Hermetic terminal for an active implantable medical device having a feedthrough capacitor partially overhanging a ferrule for high effective capacitance area

ABSTRACT

A filter feedthrough for an AIMD includes an electrically conductive ferrule. An insulator hermetically seals a ferrule opening with either a first gold braze, a ceramic seal, a glass seal or a glass-ceramic seal. At least one conductive pathway is hermetically sealed to and disposed through the insulator body in non-conductive relationship with the ferrule. A feedthrough capacitor includes at least one active and ground electrode plate disposed within a capacitor dielectric and electrically connected to a capacitor active metallization and a capacitor ground metallization, respectively. At least a first edge of the feedthrough capacitor extends beyond a first outermost edge of the ferrule. At least a second edge of the feedthrough capacitor does not extend beyond a second outermost edge of the ferrule, or said differently, the second edge is either aligned with or setback from the second outermost edge of the ferrule.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. application Ser. No.16/121,716, filed on Sep. 5, 2018, which is a continuation of U.S.application Ser. No. 15/943,998, filed on Apr. 3, 2018, which claimspriority to U.S. provisional application Ser. No. 62/646,552, filed onMar. 22, 2018, the contents of which are fully incorporated herein byreference.

FIELD OF THE INVENTION

The present invention generally relates to active implantable medicaldevices and hermetic terminal subassemblies. More particularly, thepresent invention relates to a hermetic terminal for an activeimplantable medical device having a capacitor that overhangs the ferruleon at least one side and then also does not overhang the ferrule onanother side.

BACKGROUND OF THE INVENTION

FIG. 1 illustrates various types of active implantable and externalmedical devices 100 that are currently in use. FIG. 1 is a wire formeddiagram of a generic human body showing a number of implanted medicaldevices. 100A is a family of external and implantable hearing deviceswhich can include the group of hearing aids, cochlear implants,piezoelectric sound bridge transducers and the like. 100B includes anentire variety of neurostimulators and brain stimulators.Neurostimulators are used to stimulate the Vagus nerve, for example, totreat epilepsy, obesity and depression. Brain stimulators are similar toa pacemaker-like device and include electrodes implanted deep into thebrain for sensing the onset of a seizure and also providing electricalstimulation to brain tissue to prevent the seizure from actuallyhappening. The leadwires that come from a deep brain stimulator areoften placed using real time imaging. Most commonly such leadwires areplaced during real time MRI. 100C shows a cardiac pacemaker, which iswell-known in the art, and which may have endocardial or epicardialleads. Implantable pacemakers may also be leadless. The family ofcardiac pacemakers 100C includes the cardiac resynchronization therapydevices (CRT-D pacemakers) and leadless pacemakers. CRT-D pacemakers areunique in that they provide electrical stimulation therapy to pace boththe right and the left sides of the heart. The family also includes alltypes of implantable loop recorders or biologic monitors, such ascardiac monitors. Referring once again to element 100C, the cardiacpacemaker could also be any type of biologic monitoring and/or datarecording device, including loop recorders or the like. 100D includesthe family of left ventricular assist devices (LVADs) and artificialhearts. 100E includes an entire family of drug pumps which can be usedfor dispensing of insulin, chemotherapy drugs, pain medications and thelike. Insulin pumps are evolving from passive devices to ones that havesensors and closed loop systems, which permit real time monitoring ofblood sugar levels. These devices tend to be more sensitive to EMI thanpassive pumps that have no sense circuitry or externally implantedleadwires. 100F includes a variety of external or implantable bonegrowth stimulators for rapid healing of fractures. 100G includes urinaryincontinence devices. 100H includes the family of pain relief spinalcord stimulators and anti-tremor stimulators. 100H also includes anentire family of other types of neurostimulators used to block pain.100I includes a family of implantable cardioverter defibrillator (ICD)devices and also includes the family of congestive heart failure devices(CHF). CHF devices are also known in the art as cardio resynchronizationtherapy devices or CRT devices. Although 100I is described as animplantable defibrillator, it is noted that, like pacemakers, theseimplantable cardioverter defibrillators can have either endocardial orepicardial leads. Additionally, implantable defibrillators also includesa new family of subcutaneous defibrillators. As used herein, ICDsinclude subcutaneous defibrillators, CHF, CRT and CRT-D devices. CRTdevices of the ICD family are cardiac resynchronization therapy devicesthat not only provides electrical stimulation therapy to pace the heartbut is also capable of providing high-voltage defibrillation therapywhen required. 100J illustrates an externally worn pack. This pack couldbe an external insulin pump, an external drug pump, an externalneurostimulator, a Holter monitor with skin electrodes or even aventricular assist device power pack. As used herein, the term AIMDincludes any device implanted in the human body that has at least oneelectronic component.

FIG. 2 illustrates a side view of prior art cardiac pacemaker 100C. Thepacemaker electronics are housed in a hermetically sealed and conductiveelectromagnetic shield 116 (typically titanium). There is a header blockassembly 101 generally made of thermal-setting non-conductive plastic,such as Tecothane®. This header block assembly 101 houses one or moreconnector assemblies generally in accordance with ISO Standards IS-1,IS-2, or more modern standards, such as IS4 or DF4. These header blockconnector port assemblies are shown as 103 and 103′. Implantableleadwires 107, 107′ have proximal plugs 105, 105′ and are designed toinsert into and mate with these header block connector cavities 103 and103′, or, in devices that do not have header block assemblies, are builtdirectly into the pulse generator itself.

As used herein, the term “lead” refers to an implantable lead containinga lead body and one or more internal lead conductors. A “lead conductor”refers to the conductor that is inside of an implanted lead body. Theterm “leadwire” or “lead wire” refers to wiring that is either inside ofthe active implantable medical device (AIMD) housing or inside of theAIMD header block assembly or both. Furthermore, as used herein, ingeneral, the terms lead, leadwire and pin are all used interchangeably.Importantly, they are all electrical conductors. This is why, in thebroad sense of the term, lead, leadwire or pin can all be usedinterchangeably since they are all conductors. The term “conductivepathway” can also be used to be synonymous with lead conductor, lead,leadwire or pin or even a circuit trace. As described herein, compositeconductive sintered paste filled vias passing through an insulator innonconductive relation with a ferrule electrically acts the same as aleadwire, lead wire, or pin. These sintered-paste filled vias(conductive pathway) may also incorporate co-fired solid leadwires(conductive pathway). As used herein, the term paste generally refers topastes, inks, gels, paints, cermets, and other such metal and/ormetal/ceramic sinterable material combinations that can be flowable,injectable, pressed, pulled, pushed or otherwise movable into an orificeor via. Post-sintering, the solvents and binders are baked out and,after sintering, the paste becomes a densified solid with monolithicstructure. For example, see FIGS. 44A-46 herein.

Referring now back to FIG. 2, one will appreciate that the activeimplantable medical device 100C, in this case, would be a cardiacpacemaker, an implantable cardioverter defibrillator (ICD) or a cardiacresynchronization device, such as cardiac resynchronization pacemakers(CRT-P) or cardiac resynchronization defibrillators (CRT-D) devices. Itwill be further appreciated that the pulse generator 100C illustrated inFIG. 2, could be various types of neurostimulators, which may or may nothave a Tecothane® header block, as illustrated. Some neurostimulatorshave their own plugs and connectors and others, such as cochlearimplants, may be directly wired from the active implantable medicaldevice or pulse generator (PG), for example, to the cochlear nervebundle.

Additionally, AIMD, as defined herein, includes electronic circuitsdisposed within the human body that have a primary or secondary battery,or have an alternative energy source, such as energy induced by motion,thermal or chemical effects or through external induction. As usedherein, the term “header block” is the biocompatible material thatattaches between the AIMD housing and the lead. The term “header blockconnector assembly” refers to the header block including the connectorports for the leads and the wiring connecting the lead connector portsto the hermetic terminal subassemblies which allow electricalconnections to hermetically pass inside the device housing. It is alsounderstood by those skilled in the art that the present invention can beapplicable to active implantable medical devices that do not have aheader block or header block connector assemblies such as pulsegenerators. Referring once again to FIG. 2, one can see that EMI (orelectromagnetic interference) is showing undesirably coupling toimplanted leads 107 and 107′. Electromagnetic interference is verycommon in a patient environment and includes signals from cellulartelephones, microwave ovens, airport radars and the like.

FIG. 2A shows the wire man of FIG. 1 (a human patient) with an implantedactive implantable medical device 100C and implanted leadwires 107, asshown. The patient, in this case, is holding a cellular telephone, whichis producing a very strong radio frequency (RF) field. One can see thatas this field propagates, it cuts across the implanted leadwires 107where this electromagnetic interference energy (RF), otherwise known asEMI, is couple onto the leads.

The generally titanium conductive housing 116 of the AIMD forms anelectromagnetic shield and protects internal electronics from radiatedinterference. Once electromagnetic interference is coupled to leadwires,it can be undesirably conductively coupled through the header block 101and through the hermetic terminal feedthrough assembly 120 to deviceelectronics, such as those indicated by device circuit board 122. In theprior art, it is very common that a feedthrough filter capacitor 132 bedisposed at the point of leadwire entry into the shielded housing 116.The purpose of the feedthrough is to decouple the unwanted highfrequency electromagnetic interference and divert it harmlessly to theoverall electromagnetic shield 116. In this way, the conductive EMIcannot reach the sensitive AIMD electronic circuits. For example, in acardiac pacemaker, electromagnetic interference can be interpreted bythe device electronics as a normal heartbeat and thereby, cause thepacemaker to inhibit. This means that the pacing pulses would cease,which would become immediately life-threatening for a pacemakerdependent patient.

FIG. 3 illustrates a prior art unipolar feedthrough capacitor 132. Aquadpolar feedthrough capacitor 132 was previously illustrated in priorart FIG. 2. However now referring back to FIG. 3, one can see that thereis an external metallization 142 and a passageway or feedthrough holemetallization 144. This metallization can be applied by electroplatingor by applying a metal fritted glass, which is then fired. In oneembodiment, the fritted glass may comprise a silver or palladium silverglass matrix. In any event, after application of the metallizationlayers 142 and 144, one can make electrical contact to the feedthroughcapacitor either by soldering or using thermal-setting conductiveadhesives or the like. As shown, the feedthrough capacitor comprisesactive electrode plates 148 and ground electrode plates 146. The reasonthe electrode plates 146 are called ground electrode plates and as willbe further explained herein, is because the perimeter or outsidediameter metallization 142 is configured to be attached to a ferrule 112and in turn, to the conductive housing 116 of an AIMD, which forms anequipotential surface for energy dissipation (aka ground). Referringonce again to FIG. 2, one can see that the housing 116, for an activeimplantable medical device, is generally metallic (titanium). One canalso see that the feedthrough capacitor 132 is attached to ahermetically sealed subassembly 120 of the AIMD, which acts as anequipotential surface (ground).

FIG. 3A is taken generally from section 3A-3A from FIG. 3. Shown inexploded view, are ceramic cover sheets 147, active electrodes 148 thatare disposed on ceramic layers 149 and ground electrode plates 146 thatare disposed on ceramic layers 149. These are stacked up with coversheets on the opposite end 147 and then pressed and laminated. It willbe appreciated that blank cover sheets 147 can be disposed between theactive layers 148 and the ground layers 146 thereby, increasing thedielectric thickness and increasing the voltage rating of the device.The electrode layers 148 and 146 are typically applied by silk-screeningor equivalent waterfall processes.

FIG. 4 is a cross-sectional view showing the unipolar capacitor 132 ofFIG. 3 mounted to a ferrule 112 of a hermetic seal subassembly 120 foran AIMD. As can be seen, the ground metallization 142 of the feedthroughcapacitor 132 is electrically connected 152 to the ferrule 112 of thehermetic seal. The hermetic seal is accomplished generally by goldbrazing 162 between an alumina insulator 160. There is an outsidediameter gold braze 150 between the insulator and the ferrule 112. Thereis also a gold braze 162 between leadwires 114, 111 and the insidediameter of an insulator 160 passageway as illustrated. In order forgold braze material 150, 162 to wet to the insulator surfaces 160, theremust first be an adhesion layer 153 and then a wetting layer 151, asillustrated. In one embodiment, the adhesion layer can be a sputteredlayer of titanium, followed by a sputtered layer of molybdenum orniobium (the wetting layer). In some manufacturing agent operations, theadhesion and wetting layers can be combined into a single layer.Throughout the present invention, sometimes in order to simplify thedrawings, the adhesion layer 153 and wetting layer 151 are not shown orat least not described. But it will be understood that anywhere that agold braze 150, 162 is described herein to an insulator 160, that anadhesion/wetting layer is required.

Referring once again to FIG. 4, shown is a prior art unipolar discoidal.In the case where this unipolar discoidal was intended for use in anAIMD known as an implantable cardioverter defibrillator, this would meanthat the capacitor 132 would have to handle high-voltage pulses when theimplantable defibrillator delivers its high-voltage cardioversion shockto heart tissues. When the high-voltage wave front travels to the heart,the feedthrough capacitor 132, which is sitting there uncharged, mustsuddenly charge up to the full defibrillator pulse voltage, which can beon the order of 700 to 850 volts. Studies by the inventors have shownthat this voltage can conductively ring up to as high as 1200 volts.Looking carefully at the unipolar capacitor 132 of FIG. 4, one can seethat there is a ground electrode plate 146 oriented on the bottom of theunipolar feedthrough capacitor towards the AIMD electronics and that onthe top of the feedthrough capacitor, there is a second ground electrodeplate 146 disposed towards the body fluid side. In other words, the sideof the capacitor that is mounted to at least one of the ferrule 112 andthe insulator 160. These upper and lower ground electrode plates canalso be seen in the partial section of FIG. 3. One can see that there isa ground electrode plate connected to the capacitor's diametermetallization 142, which is its ground metallization, which is connectedto the ferrule. Again, there is a ground electrode plate 146 oriented upand down. When one performs equipotential high-voltage modeling of thestresses both inside and outside the capacitor, having a groundelectrode plate disposed both upwardly and downwardly constrains thehigh-voltage fields to the inside of the capacitor. This preventshigh-voltage fields from occurring between the bottom of the capacitorand the conductive ferrule 112 or, on the top of the capacitors to otherstructures inside of the AIMD, such as a circuit board or a batteryhousing or any of the other conductive objects. Accordingly, there is anadvantage to having a ground plate up and a ground plate down to managethe electric fields in and around a feedthrough capacitor.

As defined herein, what is referred to as the insulator is generallydisposed between or inside a ferrule opening and has either leadconductors or conductive passageways or vias that pass through thehermetic terminal subassembly 120. The ceramic capacitor 132 also usesinsulative materials, which are dielectrics. As previously described inFIG. 3A, these dielectric sheets 147,149 are referred to as dielectricsalthough it is appreciated that they are also insulative. In summary, asused herein, insulators are the insulators that are gold brazed to aferrule of the AIMD, whereas capacitor dielectric insulators arereferred to as dielectric layers. Referring once again to FIG. 4, itwill also be appreciated that instead of alumina insulator withcorresponding gold brazes 150 and 162, the hermetic seal insulator couldcomprise glass or glass ceramics, which would either be directly fusedor compressed to the corresponding ferrule 42 and leadwire 111 thereby,eliminating the need for gold brazes. Throughout the drawings showing inthe patent, it will be appreciated that hermetic seal insulators couldbe replaced by glass or glass ceramic insulators. The insulator 160partially resides inside of a hole that passes through the ferrule 112.This is from a body fluid side to the device side, as shown. It will beappreciated that the insulator 160 need not be disposed inside of aferrule opening. Instead, the insulator 160 could be disposed on top ofthe ferrule and gold braze 150 could connect the insulator 160 to thetop ferrule surface 112.

Referring once again to FIG. 4, one can see that the ferrule 112 of thehermetic seal has been laser welded 154 into the overall housing 116 ofthe AIMD. This is very important in that the feedthrough capacitorground metallization 142 becomes part of the overall electromagneticshield of the AIMD housing. This forms in the industry what is known asa Faraday cage and provides an effective electromagnetic interferenceshield and energy dissipating surface. Referring back to FIG. 4, lead114 on the body fluid side is generally connected to implanted leadwiresand tissue stimulating electrodes (not shown). Referring back to FIG. 2for a prior art pacemaker, one can see these leadwires 107 and 107′ thatare connected to electrodes 109 that are located within the human heart.Again, referring to FIGS. 2 and 2A, undesirably, electromagneticinterference (EMI) can be coupled to these implanted leads and in turn,to the interior of the AIMD housing. It has been shown in numerousarticles that EMI can disrupt the proper operation of the AIMD, such asa cardiac pacemaker and lead to improper therapy or even completeinhibition of therapy. Inhibition of therapy, for a cardiac pacemaker,can be immediately life-threatening to a pacemaker dependent patient.

Referring once again to FIG. 4, electromagnetic interference signalstherefore, may be conducted along leadwire 114 to terminal 1 of thefeedthrough capacitor. It is the purpose of the feedthrough capacitor132 to divert unwanted high-frequency EMI signals from the leadwire 114,111 so that by the time the signals reach terminal 2 (the AIMDelectronics or device side), that the electromagnetic interference hasbeen greatly attenuated or diverted through the feedthrough capacitor,harmlessly to the AIMD housing 116. Referring back to FIG. 4, one willappreciate that the leadwire coming from the body fluid side 114 passesthrough the insulator 160 and the feedthrough capacitor 132. Theleadwire is a continuous conductor but is labeled 111 on the deviceside. In other words, the leadwire has a body fluid portion 114 and adevice side portion 111.

This is further appreciated by looking at the schematic diagram of FIG.4A. Electromagnetic interference signals enter terminal 1 of the3-terminal feedthrough capacitor and are diverted harmlessly to theground terminal 3 (116) before they can reach the device side 111,terminal 2. The feedthrough capacitors ground electrode plate 146, whenproperly installed, acts electrically as a continuous part of thetitanium shield 116, which houses the active implantable medical device(AIMD). The feedthrough capacitor is a 3-terminal coaxial device whoseinternal electrode plates “plug the insulator hole” and both reflect andabsorb EMI fields. Referring back to FIG. 4 and imagining that thefeedthrough capacitor 132 has been removed, the insulator 160 acts as awave guide. At certain frequencies, radiated electromagneticinterference may pass right through the insulator just like light passesthrough a window. This can be very problematic for a closely heldemitter, such as a cellular telephone, which may even be placed in ashirt pocket right over the implant. Importantly, the feedthroughcapacitor 132, when properly installed, plugs this RF hole or window(wave guide), such that its active and ground electrode plates form acontinuous part of the shield. The feedthrough capacitor is novel inthat, it is a broadband low pass filter, which allows desirablefrequencies (like pacing pulses) to pass. Because it is a unique3-terminal coaxial device, it provides effective attenuation toundesired signals (EMI) over a very broad band (10 MHz to 10 GHzfrequency range). When designed and installed properly, feedthroughcapacitors are very low inductance devices, which do not seriesresonate. It is very important that feedthrough capacitors be installedin such a way that undesirable resistances, for example, due to titaniumoxides, cannot occur in the ground connection.

FIG. 5A illustrates a quadpolar feedthrough capacitor (meaning fourpassageways), such as previously illustrated in FIG. 2. It will beappreciated that any number of feedthrough holes 134 can be produced. Aspreviously described for the unipolar capacitor of FIG. 3, the quadpolarcapacitor of FIG. 5A, has ground metallization 142 and four passageways134, each having their own active metallization 144. As used herein, theterm active means an electrically active lead or passageway as opposedto a grounded connection. Active passageways may conduct therapeuticpacing pulses, biological sensing signals or even high-voltagetherapeutic shocks. For a neurostimulator application, activepassageways may include AC, pulse, triangular or many other differenttypes of waveforms; for example, for a spinal cord stimulator to createparesthesia.

FIG. 5B is taken generally from FIG. 5B-5B from FIG. 5A, whichillustrates the quadpolar feedthrough capacitor in cross-section. Onecan see that there are ground electrode plates 146, which are disposedthrough the feedthrough capacitor structure and connected to the groundmetallization 142. One can also see that each of the four quadpolarpassages 134 are associated with its own active electrode plates 148,which are electrically connected through active metallization 144. Onecan also appreciate that each of the feedthrough holes 134, 144 has itsown set of active electrodes 148 that are disposed and overlapping orsandwich-type construction between the ground electrode plates 146. Itis the overlapping of the active and ground electrode plates in thedielectric that create the individual feedthrough capacitors. Each ofthe four feedthrough capacitors are associated with its own passagewaymetallization 144.

FIG. 6 is an exploded view of the unipolar capacitor previouslyillustrated in FIGS. 5A and 5B. There are cover sheets 147 and then anactive layer showing four active electrodes 148 that are eachindividually associated with one of the four passageways. As one cansee, the ground electrode layer 146 extends in non-conductiverelationship with the active passageways to the feedthrough capacitorsoutside diameter. As before, these are stacked up in interleaverelationship to form a quadpolar feedthrough capacitor. It is theoverlapping of each one of the pie-shaped active electrode segments 148over the ground electrode 146 that comprises each one of the capacitor'seffective capacitance area (ECA). Referring once again to FIG. 6, onewill appreciate that all four of the pie-shaped active electrodesegments are of the same size. This means that the resulting feedthroughcapacitance for all four of the holes will be equal. It is not necessarythat this be the case. For example, some of the pie-shaped segments 148could be larger than others, such that they could have differentcapacitance values as well.

Referring back to FIG. 6, one will also appreciate that the effectivecapacitance area, of say C₁ goes up with a number of interleaved layers.For example, shown are two interleaved triangular areas, which doublesthe ECA. It will be appreciated that one, two, thirty, one hundred oreven hundreds of overlapping areas can be used to greatly increase theECA or n number.

FIG. 7 is the schematic drawing of the quadpolar feedthrough capacitor(C₁, C₂, C₃, C₄) of FIG. 6, but in this case, this is after thefeedthrough capacitor has been installed to a hermetic seal ferrule andinsulator with pins, as previously described. It is assumed that thefeedthrough capacitor outside diameter metallization 142 has beenconnected directly to either the titanium ferrule 112 or the AIMDhousing 116. In both cases, the ferrule and/or the housing would be oftitanium and would be subject to oxidation. Accordingly, in theschematic drawing of FIG. 7, one can see that there is an undesirableR_(oxide) shown between each of the feedthrough capacitors 132 andground 116 (AIMD housing). Referring once again to FIG. 7, one can seethat each of the feedthrough capacitors 132 is labeled with terminals 1,2 and 3. At DC or direct current, there is no difference betweenterminals 1 and 2 as that is a solid through-pin or leadwire orpassageway. However, at RF frequencies, the feedthrough capacitor 132substantially attenuates frequencies coming from the body fluid sidefrom terminal 1 into the inside of the AIMD housing or device side toterminal 2. As previously stated, these undesirable EMI signals that areentering at terminal 1, are diverted by capacitive reactance through thefeedthrough capacitor to ground terminal 3. Referring once again to FIG.7, the presence of R_(oxide) is very undesirable, as will be explainedfurther throughout this specification.

FIG. 8 illustrates a prior art rectangular feedthrough capacitor 132,which has the same number of poles (that is 4 poles or quadpolar) aspreviously illustrated in FIG. 5A. Referring once again to FIG. 8, onewill see that the quadpolar feedthrough capacitor, in this case, isrectangular. It will be appreciated throughout this invention, that thefeedthrough capacitors may be rectangular, square, have rounded corners,comprised an oval or oblong shape, ovular or even elliptical shapes. Aspreviously mentioned, the feedthrough capacitor can be quadpolar, asillustrated, or any other number of feedthrough holes 134. Referringonce again to FIG. 8, the ground metallization 142 is brought out toboth of the long sides of the feedthrough capacitor 132. This is bestunderstood by referring to FIGS. 11 and 13, which is taken generallyfrom section 13-13 from FIG. 12. This illustrates the ground electrodeplates and the fact that they are only exposed along the capacitor'slong sides where metallization 142 can be applied. Also shown as FIG.10, which is taken generally from section 10-10 from FIG. 8,illustrating four active electrodes 148. Each of these active electrodesis associated with one of the active terminal pins 111, 114. Thefeedthrough capacitor, as illustrated in FIG. 8, is shown ready forinstallation on top of a hermetic seal subassembly 120 that'sillustrated in FIG. 9. Referring to FIG. 9, one can see that there is ametallic ferrule 112, which is typically of titanium and an insulator160, which is typically of alumina and four pins or leadwires 111, 114.A hermetic and mechanical seal is made between each of the pins 111, 114and the insulator 160 by gold brazes 162. Also, the rectangularperimeter of the alumina insulator 160 is shown gold brazed 150 to theferrule 112.

FIG. 12 illustrates the feedthrough capacitor 111 installed to thehermetic seal assembly 120, as previously described in FIGS. 8 and 9. Ascan be seen, there is an electrical connection material 152, whichconnects from the capacitor's ground metallization 142 directly to theferrule 112.

FIG. 13 is taken generally from section 13-13 from FIG. 12. In thissection, one can see that there is a gold braze 150 that forms amechanical and hermetic seal between the insulator 160 and ferrule 112.There is also a hermetic seal gold braze 162 between the insulator 160and leadwire 111, 114. In this case, the feedthrough capacitor 132 isgenerally larger in diameter than the gold braze hermetic seal area 150.In this case, one can see the electrical attachment material 152connecting between the capacitor 132 ground metallization 142 into theferrule 112. Layer 164 illustrates a highly undesirable oxide layer onthe titanium surface of ferrule 112. Oxide layer 164 would appear allover the surfaces of the titanium ferrule 112 but is shown disposed onlybetween the electrical attachment material 152 and the ferrule ½ forsimplicity. Referring once again to FIGS. 12 and 13, one can see thatthe ferrule 112 has an h-flange type shape 163. This is for capturingand subsequent laser welding of AIMD housing halves 116.

FIG. 14 is a schematic diagram illustrating the undesirable presence ofR_(oxide) in the ground path of the quadpolar feedthrough capacitor.This R_(oxide) results from the oxide layer 164 previously described inFIG. 13. The presence of R_(oxide) can seriously compromise the properfiltering performance of each one of the quadpolar capacitors. R_(oxide)appears in series with the capacitive reactance. When R_(oxide) becomessignificant (on the order of 400 milliohms or higher), this canseriously degrade filtered performance.

FIG. 15 shows the use of novel gold braze bond pads 165 that are oneembodiment of a novel feature of U.S. Pat. No. 6,765,779, the contentsof which are herein are incorporated fully by this reference. This isbest understood by referring to FIG. 16 showing that the feedthroughcapacitor 132 ground metallization 142 is electrically attached 152 by athermal-setting conductive adhesive or a solder or the like directly tothis gold bond pad area 165. It is well known that gold is a very noblematerial and does not oxidize. FIG. 17 is taken from FIG. 22 of the 779patent. This electrical connection material is labeled 332 in the 779patent. When sufficiently thick, a layer of gold will effectively blocktitanium oxides from interfering with the high-frequency electricalconnection material 152. This is best understood by referring to FIG.17, which is taken from section 17-17 from FIG. 16. In thecross-section, one can see the electrical connection material 152 thateffects a very low impedance and low resistant electrical connectionbetween the feedthrough capacitor ground metallization 142 and the goldbraze pad area 165. During gold brazing, the gold braze pad 165 forms acontinuous part of the hermetic seal 150 that effects a mechanical andhermetic joint to the insulator 160. In other words, an essentialfeature of the 779 patent, is that the low impedance, low resistanceground attach area is continuous with and one of the same width, as thesame hermetic seal 150 that forms the hermetic seal gold braze. Byelectrical attachment 152 to this gold braze 150, one virtuallyeliminates R_(oxide), as illustrated in schematic FIG. 14.

FIGS. 18 and 19 herein are taken from FIGS. 23 and 24 of the 779 patent.FIG. 18 illustrates that the electrical connection material 152 contactsbetween, in this case, a round quadpolar capacitor's groundmetallization 142 and the gold braze area of the hermetic seal 165. Thisis best understood by referring to section 19-19 from FIG. 18, which isillustrated in FIG. 19. Referring to FIG. 19, one can clearly see thatthe electrical connection material 152, which can be of thermal-settingconductive adhesive or a solder or the like, makes a lowresistance/impedance (free of titanium oxides) connection between thecapacitor ground metallization 142 and at least a substantial portion ofthe gold braze pad area 165, which also forms the hermetic seal betweenthe ferrule 112 and insulator 160. This forms an oxide-resistant lowimpedance and low resistance electrical connection that would be robustat high-frequencies so that the feedthrough capacitor 132 can properlydivert unwanted high-frequency EMI energy. Referring again to FIG. 19,one will appreciate that the electrical connection material 152 needonly contact a significant portion of the gold braze bond pad area 165.In other words, a portion of the electrical connection material isshowing also connecting directly to ferrule 112. A portion of theelectrical connection material 152 that is attached to the ferrule wouldbe oxidized; however, it only takes a portion of electrical material 152to contact the oxide-resistant gold 165 to affect a low impedance andlow resistance electrical connection. As defined herein, an EMI filterhermetically sealed assembly for an active implantable medical device,will be herein designated as assembly 210. The 779 Patent has enjoyedgreat commercial success and has proven to be highly reliable.Manufacturing processes of the '779 Patent does require tightdimensional tolerances between the ferrule inside diameter and thealumina insulator outside diameter or perimeter. In addition, theoxide-resistant pads as described in the 779 Patent require asignificant amount of extra gold to be used in the process which isthereby increasingly expensive. Referring once again to FIG. 17(rectangular) and FIG. 19 (discoidal), one will appreciate a seriouslimitation. While attachment to gold has eliminated the problemsassociated with R_(oxide), the diameter of the feedthrough capacitor orthe length and the width of a rectangular capacitor have both beensignificantly constrained. For example, referring to FIG. 19, if thediameter of the feedthrough capacitor 132 were increased such that itsoutside diameter metallization 142 was either aligned with the outermostperimeter of the ferrule or slightly smaller than the outermostperimeter of the ferrule, one could see that there would be no possibleway to make the electrical connection 152 to the gold braze pad area165. Over the past several years, the number of leads required for thefeedthrough of an active implanted medical device have constantlyincreased. This can be best understood in the cardiac space where earlypacemakers only paced the right ventricle. Then dual chamber pacing camealong with bipolar electrodes in both the right ventricle and the rightatrium. Modern devices, also known as cardiac resynchronization devicesnow have quadpolar leads that are routed through the coronary sinus andare outside the left ventricle. Added to these are defibrillationfunctions. Accordingly, modern devices have as many as 8, 10 or even 12leads. A significant market driving force is the need to make thesemulti-lead devices thin enough and small enough for patient comfort ashaving too thick of an AIMD housing placed in the pectoral pocket,becomes very uncomfortable for the patient. In summary, the gold bondpads of FIGS. 17 and 19, work very well to eliminate the oxidationproblem, but do constrain the geometry such that the resultant deviceshave relatively low volumetric efficiency.

FIG. 19A illustrates filter performance otherwise known as attenuationor insertion loss curves vs frequency. An ideal attenuation curve isshown for a feedthrough capacitor C, 132. One can see that it has aslight self-resonance (SRF) above 1 GHz and then continues to function.Accordingly, it becomes a broadband 3-terminal filter as previouslydescribed. As can be seen, the ideal feedthrough capacitor has over 30dB of attenuation at all frequencies above 100 MHz. This frequency rangeis important because that's the range at which cell phones operate andother emitters. Cell phones are of particular concern to activeimplantable medical devices because they are small and can be broughtinto very close proximity to a medical implant. For example, one concernis for a pacemaker patient where the cell phone may be placed in a shirtpocket directly over the implant. This would couple maximum energy toimplanted leads. Referring once again to the insertion loss attenuationcurves of FIG. 19A, one can see what happens when the feedthroughcapacitor has undesirable resistive oxide (R_(oxide)) in its groundelectrical path. The oxide degrades the attenuation or filterperformance such that you end up with a curve, which provides less than30 dB of ‘attenuation at frequencies above 100 MHz. This seriouslydegraded filter performance is of great concern because if a closelyheld emitter, such as a cellular telephone, interferes with, forexample, a pacemaker sense circuit, it can undesirably cause thepacemaker to inhibit. Inhibit means that it would fail to providelife-saving therapeutic pulses. One might ask, why are pacemakersdesigned to inhibit? Well, there are two reasons: Many patients whosuffer from bradycardia (a very low heart rate) are not bradycardicall-day long. In other words, they can come in and out of bradycardic(life-threatening) condition. Therefore, demand pacemakers weredeveloped such that when a patient's normal sinus rhythm returns, thepacemaker will inhibit. This is to not only save battery life, but alsoprevents a condition called rate competition. This is where you wouldn'twant the pacemaker to provide a pulse that is out of sync or competitivewith a patient's intrinsic rhythm. However, this does lead toelectromagnetic interference danger. If EMI is undesirably detected as anormal cardiac pulse, it can cause the device to inhibit, which isimmediately life-threatening for a pacemaker dependent patient.

FIG. 20A illustrates a discoidal capacitor 24 with a counterbore hole 46that slips over a ferrule 28′ and a hermetic seal 30 and was taken fromFIG. 2 of U.S. Pat. No. 5,333,095, the contents of which are includedherein by reference. The feedthrough capacitor is metallized on itsoutside diameter and there is an electrical attachment 56 between thefeedthrough capacitor metallization and an AIMD housing 22 (116). Inthis case, there is no electrical connection described between thefeedthrough capacitor ground metallization and the ferrule. In fact, theopposite is taught, in that, electrical connection 56 (152) is directlyto the AIMD housing structure. It was not known at the time of the '095invention that serious problems would show up with R_(oxide), as hasbeen previously described.

FIG. 20B is a cross-sectional view taken from FIG. 6 of the '095 patent.It shows its ground electrode plates 42 (146) coming to the outsidediameter. There is a metallization (not shown) but labeled as 52 (142).It is this ground metallization that is electrically attached 56 (152)directly to the AIMD housing 22 (116). Referring to FIGS. 20A and 20B,the feedthrough capacitor 142 overhangs the ferrule 28(112), but is notelectrically connected to it. The electrical connection 56(152) isbetween the capacitor outside diameter metallization (142) directly tothe AIMD housing 22(116). In addition, the feedthrough capacitor 24(132)of FIGS. 20A and 20B is round and overhangs the ferrule in alldirections.

FIG. 20C is taken from FIG. 17 of the '095 patent and illustratescapacitor 224 (132) disposed directly onto an AIMD housing surface 22(116). As one can see, the ferrule 234 (112) has been previouslyattached to the AIMD housing 22 (116). In this case, the feedthroughcapacitor 224 (132) would be later added and then a ground connectionwould be made from the outside diameter metallization 224 (132) directlyto the AIMD housing 22 (116). In other words, there is no directconnection from the feedthrough capacitor ground metallization to theferrule at all.

Referring once again to FIG. 20D, there is an even larger problem. Thereis no way to make in effect, an electrical connection between theferrule 334 (112) and the outside diameter metallization (142) of thefeedthrough capacitor 324 (132). FIG. 13 herein, shows the problem withan effecting electrical connection 152 directly to a titanium ferrule112. As once can see, there is a highly undesirable oxide layer 164 thatis formed on the titanium. This oxide layer is both resistive and alsoacts as a semi-conductor. The presence of either a resistance or asemi-conductance, severely degrades the EMI filters ability to diverthigh-frequency RF signals. The importance of capacitor ground attachmentto an oxide-resistance ferrule surface is taught in U.S. Pat. No.6,765,779, the contents of which are incorporated herein fully byreference. FIG. 17 teaches the 779 patent methodology of having theelectrical connection material 152 connect from the feedthroughcapacitor ground metallization 142 to a gold braze extension of thehermetic seal 150, 165. Again, referring to FIG. 20D, there is nopossible way, with a capacitor 324 (132) disposed outside the ferrule,to make a connection to the gold braze area between the ferrule and theinsulator. This gold braze area is not shown but is indicated by element325.

SUMMARY OF THE INVENTION

An embodiment of the present invention is a filter feedthroughconfigured to be installed in an opening of a housing (116) an activeimplantable medical device (AIMD 100), the filter feedthroughcomprising: a) an electrically conductive ferrule (112) separating abody fluid side opposite a device side, the body fluid side configuredto reside outside the AIMD housing and the device side configured toreside inside the AIMD housing, the ferrule including a ferrule opening(306) extending between and to the body fluid side and the device side;b) an insulator (160) hermetically sealing the ferrule opening; c) atleast one conductive pathway (111,114,117,185,186) hermetically sealedto and disposed through the insulator between the body fluid side andthe device side, the at least one conductive pathway being innon-electrically conductive relation with the ferrule; d) a feedthroughcapacitor (132) disposed on the device side; e) wherein at least a firstedge (322) of the feedthrough capacitor extends beyond a first outermostedge (302) of the ferrule; and f) wherein at least a second edge (322)of the feedthrough capacitor does not extend beyond a second outermostedge (304) of the ferrule. In regard to part f), in other words, atleast a second edge of the feedthrough capacitor is either aligned withor is set back from a second outermost edge of the ferrule.

In other exemplary embodiments, the feedthrough capacitor may comprise:i) at least one active electrode plate disposed parallel and spaced fromat least one ground electrode plate, wherein the at least one active andground electrode plates are disposed within a capacitor dielectric; ii)a capacitor active metallization electrically connected to the at leastone active electrode plate and in non-electrically conductive relationwith the at least one ground electrode plate; and iii) a capacitorground metallization electrically connected to the at least one groundelectrode plate and in non-electrically conductive relation with the atleast one active electrode plate. The capacitor active metallization maybe electrically connected to the at least one conductive pathway. Thecapacitor ground metallization may be electrically connected to theferrule. The insulator may hermetically seal the ferrule opening by atleast one of a first gold braze, a ceramic seal, a glass seal or aglass-ceramic seal. The ferrule may have a rectangular shape, the firstoutermost edge and the second outermost edge forming at least a part ofthe rectangular shape. The first outermost edge of the ferrule may beperpendicular to the second outermost edge of the ferrule.

Another embodiment of the present invention is a filter feedthroughconfigured to be installed in an opening of a housing an activeimplantable medical device (AIMD), the filter feedthrough comprising: a)an electrically conductive ferrule separating a body fluid side oppositea device side, the body fluid side configured to reside outside the AIMDhousing and the device side configured to reside inside the AIMDhousing, the ferrule including a ferrule opening extending between andto the body fluid side and the device side; b) an insulator hermeticallysealing the ferrule opening by at least one of a first gold braze, aceramic seal, a glass seal or a glass-ceramic; c) at least oneconductive pathway hermetically sealed to and disposed through theinsulator between the body fluid side and the device side, the at leastone conductive pathway being in non-electrically conductive relationwith the ferrule; d) a feedthrough capacitor disposed on the deviceside, the feedthrough capacitor comprising: i) at least one activeelectrode plate disposed parallel and spaced from at least one groundelectrode plate, wherein the at least one active and ground electrodeplates are disposed within a capacitor dielectric; ii) a capacitoractive metallization electrically connected to the at least one activeelectrode plate and in non-electrically conductive relation with the atleast one ground electrode plate; and iii) a capacitor groundmetallization electrically connected to the at least one groundelectrode plate and in non-electrically conductive relation with the atleast one active electrode plate; e) wherein the capacitor activemetallization is electrically connected to the at least one conductivepathway; f) wherein the capacitor ground metallization is electricallyconnected to the ferrule; g) wherein at least a first edge of thefeedthrough capacitor extends beyond a first outermost edge of theferrule; h) wherein at least a second edge of the feedthrough capacitoris either aligned with or is set back from a second outermost edge ofthe ferrule; i) wherein the ferrule has a rectangular shape, the firstoutermost edge and the second outermost edge forming at least a part ofthe rectangular shape; and j) wherein the first outermost edge isperpendicularly disposed in relation to the second outermost edge.

Another embodiment of the present invention includes a filterfeedthrough that is attachable to an active implantable medical device(AIMD), the filter feedthrough comprising: a) a feedthrough, comprising:i) an electrically conductive ferrule separating a body fluid sideopposite a device side, the ferrule comprising a ferrule outermost edge,and a ferrule opening extending to the ferrule body fluid and devicesides, wherein, when the ferrule is attached to an opening in a housingof an AIMD, the ferrule body fluid and the ferrule device sides resideoutside the AIMD and inside the AIMD, respectively; ii) an insulator atleast partially residing in the ferrule opening where the insulator ishermetically sealed to the ferrule; iii) at least one active via holeextending through the insulator; iv) an active conductive pathwayresiding in and hermetically sealed to the insulator in the at least oneactive via hole; b) a feedthrough capacitor disposed on the device sideof the ferrule, the feedthrough capacitor comprising: i) at least oneactive electrode plate interleaved in a capacitive relationship with atleast one ground electrode plate, wherein the at least one active andground electrode plates are disposed in a capacitor dielectric; ii) atleast one active passageway extending through the capacitor dielectric,the at least one passageway having a capacitor active metallizationelectrically connected to the at least one active electrode plate; iii)a capacitor ground metallization electrically connected to the at leastone ground electrode plate; c) a first electrical connection materialelectrically connecting the active pathway of the insulator to theactive metallization electrically connected to the at least one activeelectrode plate; and d) a second electrical connection materialelectrically connecting the capacitor ground metallization electricallyconnected to the at least one ground electrode plate to the ferrule; e)wherein a first portion of the feedthrough capacitor extends beyond theoutermost edge of the ferrule, and a second portion is spaced inwardlyfrom the outermost edge of the ferrule.

Another embodiment of the present invention includes a filterfeedthrough that is attachable to an active implantable medical device(AIMD), the filter feedthrough comprising: a) a feedthrough, comprising:i) an electrically conductive ferrule (112) comprising a ferrulesidewall (309) extending to a ferrule body fluid side end (308) surfaceand to a ferrule device side end surface (310), the ferrule sidewallfurther comprising a ferrule outermost surface (302,304) and a ferruleinner surface (307) defining a ferrule opening (306) extending to theferrule body fluid and device side end surfaces, wherein, when theferrule is attached to an opening in a housing (116) of an AIMD (100),the ferrule body fluid side end surface and the ferrule device side endsurface reside outside the AIMD and inside the AIMD, respectively; ii)an insulator (160) at least partially residing in the ferrule openingwhere the insulator is hermetically sealed to the ferrule, the insulatorextending to an insulator body fluid side end surface (312) and to aninsulator device side end surface (314); iii) at least one active viahole (316) extending through the insulator to the insulator body fluidand device side end surfaces; and iv) an active conductive pathway(111,114,117,185,186) residing in and hermetically sealed to theinsulator in the at least one active via hole; b) a feedthroughcapacitor (132) disposed on the device side of the ferrule, thefeedthrough capacitor comprising: i) a capacitor dielectric (147) havinga capacitor dielectric outer sidewall (322) extending to a capacitordielectric first end surface (326) and to a capacitor dielectric secondend surface (324); ii) at least one active electrode plate (148)interleaved in a capacitive relationship with at least one groundelectrode plate (146) in the capacitor dielectric; iii) at least oneactive passageway (134) extending through the capacitor dielectric tothe capacitor dielectric first and second end surfaces; iv) a capacitoractive metallization (144) contacting the capacitor dielectric in the atleast one active passageway and being electrically connected to the atleast one active electrode plate; and v) a capacitor groundmetallization (142) electrically connected to the at least one groundelectrode plate; and c) a first electrical connection material (156)electrically connecting the active conductive pathway residing in the atleast one active via hole in the insulator to the active metallizationelectrically connected to the at least one active electrode plate of thefeedthrough capacitor; and d) a second electrical connection material(152) electrically connecting the capacitor ground metallizationelectrically connected to the at least one ground electrode plate of thefeedthrough capacitor to the ferrule; e) wherein an imaginary projection(334,FP_(L1),FP_(L2)) of the ferrule outermost surface onto thecapacitor dielectric second end surface defines: A) at least onecapacitor dielectric imaginary first overhang portion (330) extendinglaterally outwardly beyond the ferrule outermost surface; and B) acapacitor dielectric imaginary second overlay portion (203) thatoverlays the ferrule device side end surface and overlays thehermetically sealed insulator; C) wherein at least part of the capacitordielectric outer sidewall in the capacitor dielectric imaginary secondoverlay portion is spaced inwardly (201) from the ferrule outermostsurface, and wherein the at least one ground electrode plate at leastpartially resides in the capacitor dielectric imaginary second overlayportion.

In other exemplary embodiments, at least a portion of the capacitorground metallization may contact the capacitor outer sidewall in thecapacitor dielectric imaginary second overlay portion and iselectrically connected to the ferrule by the second electricalconnection material.

The second electrical connection material electrically may connect thecapacitor ground metallization electrically connected to the at leastone ground electrode plate of the feedthrough capacitor to at least oneof the ferrule and a first gold braze hermetically sealing the insulatorto the ferrule.

The ferrule device side end surface may be provided with at least onerecessed pocket residing adjacent to the outer sidewall of the capacitordielectric imaginary second overlay portion, the recessed pocket havinga gold pocket-pad nested therein and being electrically connected to theferrule, and the second electrical connection material may electricallyconnect the capacitor ground metallization electrically connected to theat least one ground electrode plate at least partially residing in thecapacitor dielectric imaginary second overlay portion to the goldpocket-pad.

The ferrule outermost surface may comprise opposed ferrule first andsecond outermost surface portions meeting opposed ferrule third andfourth outermost surface portions; and the capacitor dielectric outersidewall may comprise opposed capacitor dielectric first and secondouter sidewall portions meeting opposed capacitor dielectric third andfourth outer sidewall portions, wherein the imaginary projection of theferrule outermost surface onto the capacitor dielectric second endsurface may provide the ferrule first and second outermost surfaceportions intersecting the capacitor dielectric third and fourth outersidewall portions to thereby provide: A) the capacitor dielectric firstoverhang portion comprising the capacitor dielectric first outersidewall portion extending laterally outwardly beyond the ferrule firstoutermost surface portion; B) the capacitor dielectric imaginary secondoverlay portion overlaying the ferrule device side end surface and thehermetically sealed insulator; and C) a capacitor dielectric thirdoverhang portion comprising the capacitor dielectric second outersidewall portion extending laterally outwardly beyond the ferrule secondoutermost surface portion; and wherein the imaginary projections of theferrule third and fourth outermost surface portions do not intersect thecapacitor dielectric third and fourth outer sidewall portions to therebyexpose portions of the ferrule device side end surface adjacent to therespective capacitor dielectric third and fourth outer sidewallportions.

The ferrule first and second outermost surface portions may be longerthan the ferrule third and fourth outermost surface portions to therebyprovide the ferrule having a first rectangular shape in plan-view, andwherein the capacitor dielectric first and second outer sidewallportions may be longer than the capacitor dielectric third and fourthouter sidewall portions to thereby provide the capacitor dielectrichaving a second rectangular shape in plan-view.

The capacitor ground metallization may contact at least one of thecapacitor dielectric third and fourth outer sidewall portions, andwherein the second electrical connection material electrically connectsthe capacitor ground metallization to the ferrule device side endsurface, spaced inwardly from a corresponding one of at least one of theferrule third and fourth outermost surface portions.

The ferrule device side end surface may be provided with at least onerecessed pocket residing adjacent to at least one of the ferrule thirdand fourth outermost surface portions, the recessed pocket having a goldpocket-pad nested therein and being electrically connected to theferrule, and wherein the capacitor ground metallization contacts atleast one of the capacitor dielectric third and fourth outer sidewallportions with the second electrical connection material electricallyconnecting the capacitor ground metallization to the gold pocket-pad.

The ferrule outermost surface may comprise opposed ferrule first andsecond outermost surface portions meeting opposed ferrule third andfourth outermost surface portions, the ferrule first and secondoutermost surface portions being linear and the ferrule third and fourthoutermost surface portions having a radiused shape to thereby providethe ferrule having a first oval shape in plan-view; and the capacitordielectric outer sidewall may comprise opposed capacitor dielectricfirst and second outer sidewall portions meeting opposed capacitordielectric third and fourth outer sidewall portions, the capacitordielectric first and second outer sidewall portions being linear and thecapacitor dielectric third and fourth outer sidewall portions having aradiused shape to thereby provide the capacitor dielectric having asecond oval shape in plan-view, wherein the imaginary projection of theferrule outermost surface onto the capacitor dielectric second endsurface may provide the ferrule first and second outermost surfaceportions intersecting the capacitor dielectric third and fourth outersidewall portions to thereby provide: A) the capacitor dielectric firstoverhang portion comprising the capacitor dielectric first outersidewall portion extending laterally outwardly beyond the ferrule firstoutermost surface portion; B) the capacitor dielectric imaginary secondoverlay portion overlaying the ferrule device side end surface and thehermetically sealed insulator; and C) a capacitor dielectric thirdoverhang portion comprising the capacitor dielectric second outersidewall portion extending laterally outwardly beyond the ferrule secondoutermost surface portion, and wherein the imaginary projections of theferrule third and fourth outermost surface portions may not intersectthe capacitor dielectric third and fourth outer sidewall portions tothereby expose portions of the ferrule device side end surface adjacentto the respective capacitor dielectric third and fourth outer sidewallportions.

The capacitor ground metallization may contact at least one of thecapacitor dielectric third and fourth outer sidewall portions, andwherein the second electrical connection material electrically connectsthe capacitor ground metallization to the ferrule device side endsurface, spaced inwardly from at least one of the ferrule third andfourth outermost surface portions.

The ferrule device side end surface may be provided with at least onerecessed pocket residing adjacent to at least one of the ferrule thirdand fourth outermost surface portions, the recessed pocket having a goldpocket-pad nested therein and being electrically connected to theferrule, and wherein the capacitor ground metallization contacts atleast one of the capacitor dielectric third and fourth outer sidewallportions with the second electrical connection material electricallyconnecting the capacitor ground metallization to the gold pocket-pad.

The filter feedthrough may further comprise: a) at least one groundpassageway extending through the capacitor dielectric to the capacitordielectric first and second end surfaces, the capacitor groundmetallization residing in the ground passageway and being electricallyconnected to the at least one ground electrode plate; b) a peninsulaextending from the ferrule sidewall inwardly into the ferrule opening,wherein the second electrical connection material electrically connectsthe ground metallization electrically connected to the at least oneground electrode plate of the feedthrough filter to the ferrulepeninsula, and c) wherein the ferrule outermost surface comprisesopposed ferrule first and second outermost surface portions meetingopposed ferrule third and fourth outermost surface portions; and d) thecapacitor dielectric outer sidewall comprises opposed capacitordielectric first and second outer sidewall portions meeting opposedcapacitor dielectric third and fourth outer sidewall portions; e)wherein the imaginary projection of the ferrule outermost surface ontothe capacitor dielectric second end surface provides the ferrule firstand second outermost surface portions intersecting the capacitordielectric third and fourth outer sidewall portions to thereby providethe capacitor dielectric first overhang portion comprising the capacitordielectric first outer sidewall portion extending laterally outwardlybeyond the ferrule first outermost surface portion, a capacitordielectric imaginary second overlay portion overlaying the ferruledevice side end surface and the hermetically sealed insulator, and acapacitor dielectric third overhang portion comprising the capacitordielectric second outer sidewall portion extending laterally outwardlybeyond the ferrule second outermost surface portion; and f) wherein theimaginary projections of the ferrule third and fourth outermost surfaceportions do not intersect the capacitor dielectric third and fourthouter sidewall portions to thereby expose portions of the ferrule deviceside end surface adjacent to the respective capacitor dielectric thirdand fourth outer sidewall portions; and g) wherein the capacitor groundmetallization also contacts the capacitor dielectric third and fourthouter sidewall portions, and wherein the second electrical connectionmaterial also electrically connects the capacitor ground metallizationto the ferrule device side end surface, spaced inwardly from the ferrulethird and fourth outermost surface portions.

The ferrule first and second outermost surface portions may be longerthan the ferrule third and fourth outermost surface portions, and thecapacitor dielectric first and second outer sidewall portions are longerthan the capacitor dielectric third and fourth outer sidewall portions.

The active conductive pathway in the insulator may comprise a metallicleadwire residing in the at least one active via hole where a gold brazehermetically seals the leadwire to the insulator.

The leadwire may extend to a leadwire body fluid side portion extendingoutwardly beyond the insulator body fluid side end surface and aleadwire device side portion extending outwardly beyond the insulatordevice side end surface, the leadwire device side portion residing inthe at least one active passageway in the capacitor dielectric where theleadwire is electrically connected to the at least one active electrodeplate of the feedthrough capacitor.

The at least one active via hole in the insulator may be defined by anactive via hole inner surface extending along a longitudinal axis to theinsulator body fluid and device side end surfaces, and wherein theactive conductive pathway residing in the at least one active via holecomprises: a) a layer of a ceramic reinforced metal composite (CRMC)comprising a mixture of alumina and platinum that contacts the activevia hole inner surface, the layer of CRMC extending from a CRMC firstend residing at or adjacent to the insulator device side end surface toa CRMC second end residing at or adjacent to the insulator body fluidside end surface, wherein an inner surface of the CRMC is spaced towardthe longitudinal axis with respect to the via hole inner surface; and b)a substantially pure platinum material that contacts the CRMC innersurface, the substantially pure platinum material extending from asubstantially pure platinum material first end residing at or adjacentto the insulator device side end surface to a substantially pureplatinum material second end residing at or adjacent to the insulatorbody fluid side end surface.

The CRMC first and second ends and the substantially pure platinummaterial first and second ends may extend to the respective insulatorbody fluid and device side end surfaces.

At least one of the CRMC first and second ends may be recessed inwardlyinto the active via hole from the respective insulator body fluid anddevice side end surfaces, and wherein the substantially pure platinummaterial may extend to the insulator body fluid and device side endsurfaces.

At least one of the CRMC first and second ends may be recessed inwardlyinto the active via hole in the insulator from the respective insulatorbody fluid and device side end surfaces, and wherein a corresponding atleast one of the substantially pure platinum material first and secondend may be recessed inwardly into the active via hole from therespective insulator body fluid and device side end surfaces, andwherein a metallic end cap may extend from the at least one recessedCRMC first and second end and the correspondingly recessed substantiallypure platinum material first and second end to the correspondinginsulator body fluid and device side end surface.

The metallic end cap may comprise platinum. The substantially pureplatinum material is a platinum wire. The platinum wire may be exposedat the insulator device side end surface. The platinum wire may extendthrough the substantially pure platinum material to the insulator bodyfluid and device side end surfaces, the platinum wire being spaced fromthe layer of CRMC contacting the active via hole inner surface in theinsulator.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings illustrate the invention. In such drawings:

FIG. 1 is a wire-formed diagram of a generic human body showing a numberof exemplary implantable medical devices;

FIG. 2 is a side view of a prior art cardiac pacemaker;

FIG. 2A is a wire-formed diagram illustrating how RF fields are absorbedinto a lead of an implantable medical device;

FIG. 3 is an isometric cut-away view of a prior art unipolar feedthroughcapacitor;

FIG. 3A is an exploded isometric view of the unipolar capacitor of FIG.3;

FIG. 4 is a sectional view of a prior art hermetic feedthrough terminal;

FIG. 4A is an electrical schematic of the structure of FIG. 4;

FIG. 5A illustrates a quadpolar feedthrough capacitor;

FIG. 5B is a sectional view taken generally from FIG. 5B-5B from FIG.5A, which illustrates the quadpolar feedthrough capacitor of FIG. 5A;

FIG. 6 is an exploded isometric view of the unipolar capacitorpreviously illustrated in FIGS. 5A and 5B;

FIG. 7 is the schematic drawing of the feedthrough capacitor of FIGS.5A-5B;

FIG. 8 illustrates a prior art rectangular feedthrough capacitor, whichhas the same number of poles (4, quadpolar) as previously illustrated inFIG. 4A;

FIG. 9 is an isometric view illustrating the hermetic seal subassemblyready to receive the capacitor of FIG. 8;

FIG. 10 is taken generally from section 10-10 from FIG. 8 showing theactive electrode plates;

FIG. 11 is taken generally from section 11-11 from FIG. 8 showing theground electrode plate;

FIG. 12 illustrates the feedthrough capacitor installed to the hermeticseal assembly as previously described in FIGS. 8 and 9;

FIG. 13 is a sectional view taken generally from section 13-13 from FIG.12;

FIG. 14 is an electrical schematic diagram illustrating the undesirablepresence of an oxide in the ground path of the quadpolar feedthroughcapacitor;

FIG. 15 shows the use of novel gold braze bond pads that are oneembodiment of a novel feature of the '596 patent;

FIG. 16 shows that the feedthrough capacitor ground metallization iselectrically attached by a thermal-setting conductive adhesive directlyto the gold bond pad area;

FIG. 17 is a sectional view taken from section 17-17 from FIG. 16;

FIG. 18 is an isometric view taken from FIG. 23 of the 779 patent;

FIG. 19 is a sectional view of the structure of FIG. 18 taken alonglines 19-19;

FIG. 19A illustrates filter performance otherwise known as attenuationor insertion loss curves versus frequency;

FIG. 20A illustrates sectional isometric view of a prior artfeedthrough;

FIG. 20B is a sectional view of a prior art feedthrough;

FIG. 20C is an exploded sectional view of a prior art feedthrough;

FIG. 20D is an exploded sectional view of a prior art feedthrough;

FIG. 21A is an isometric view of just a ferrule that can be used withthe present invention;

FIG. 21B is a sectional view of one embodiment of a ferrule taken alonglines 21B-21B from FIG. 21A;

FIG. 21C is a sectional view of another embodiment of the ferrule takenalong lines 21C-21C from FIG. 21A;

FIG. 21D is an isometric view of just an insulator that can be used withthe present invention;

FIG. 21E is a sectional view taken along lines 21E-21E of FIG. 21D;

FIG. 21F is an isometric exploded view of a feedthrough before thepresent invention capacitor is attached;

FIG. 22 is an isometric view of the present invention where thecapacitor overhangs the ferrule edge on two edges for an increasedeffective capacitance area;

FIG. 22A is a sectional isometric view taken along lines 22A-22A fromFIG. 22;

FIG. 22B is a sectional isometric view taken along lines 22B-22B fromFIG. 22;

FIG. 22C is a sectional isometric view taken along lines 22C-22C fromFIG. 22;

FIG. 22D is a sectional isometric view taken along lines 22D-22D fromFIG. 22;

FIG. 22E is a side view taken along lines 22E-22E from FIG. 22;

FIG. 22F is a side view taken along lines 22F-22F from FIG. 22;

FIG. 22G is an isometric view of another embodiment of the presentinvention where now the capacitor only overhangs the ferrule along oneedge of the ferrule;

FIG. 22H is a side view taken along lines 22H-22H from FIG. 22G;

FIG. 22I is a side view taken along lines 22I-22I from FIG. 22G;

FIG. 22J is a side view similar to FIG. 22H now showing a new embodimentsimilar to FIG. 22G where the capacitor is aligned along the left side;

FIG. 22K is a side view similar to FIG. 22I if it was taken of thestructure of FIG. 22J along the lines 22H-22H of FIG. 22G;

FIG. 22L is a sectional view of the active electrode plates taken alonglines 22L-22L of FIG. 22E;

FIG. 22M is a sectional view of the active electrode plates taken alonglines 22M-22M of FIG. 22H;

FIG. 22N is a sectional view of the active electrode plates taken alonglines 22N-22N of FIG. 22J;

FIG. 22O is a simplified top view illustrating one embodiment of thecapacitor overhanging the ferrule;

FIG. 22P is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22Q is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22R is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22S is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22T is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22U is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22V is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 22W is a simplified top view illustrating another embodiment of thecapacitor overhanging the ferrule;

FIG. 23 is an isometric view of another embodiment of the presentinvention now having gold pocket pads;

FIG. 23A is an enlarged isometric view of another embodiment of a pocketwith an oxide-resistant metal trough or an oxide-resistant metaladdition such as platinum wire for grounding;

FIG. 24 is an isometric view of the present invention similar to FIG. 23now with an overhanging capacitor;

FIG. 24A is a sectional isometric view taken along lines 24A-24A fromFIG. 24;

FIG. 24B is a sectional isometric view taken along lines 24B-24B fromFIG. 24;

FIG. 24C is a side view taken along lines 24C-24C from FIG. 24;

FIG. 24D is a side view taken along lines 24D-24D from FIG. 24;

FIG. 25 is an exploded isometric view of another embodiment of thepresent invention;

FIG. 26 is an isometric view of the structure of FIG. 25 now with thecapacitor installed;

FIG. 26A is an isometric view taken along lines 26A-26A from FIG. 26;

FIG. 26B is an isometric view taken along lines 26B-26B from FIG. 26;

FIG. 26C is an isometric view taken along lines 26C-26C from FIG. 26;

FIG. 26D is an isometric view taken along lines 26D-26D from FIG. 26;

FIG. 27 is an electrical schematic of the structure of FIG. 26;

FIG. 28 illustrates an isometric view of a hybrid feedthrough capacitorof the present invention;

FIG. 29 is a sectional view of a ground electrode plate taken alonglines 29-29 of FIG. 28;

FIG. 30 is a sectional view of a ground electrode plate taken alonglines 30-30 of FIG. 28;

FIG. 31 illustrates an isometric view of a feedthrough assembly having abridge for an internal ground attachment and a gold pocket pad for anexternal ground attachment to use with the capacitor of the presentinvention;

FIG. 32 is a top view of the structure of FIG. 32 taken along lines32-32;

FIG. 33 is a sectional side view taken along lines 33-33 from FIG. 32;

FIG. 34 illustrates an isometric view of a feedthrough assembly having apeninsula for an internal ground attachment and a gold pocket pad for anexternal ground attachment to use with the capacitor of the presentinvention;

FIG. 35 is a top view of the structure of FIG. 34 taken along lines35-35;

FIG. 36 is a sectional side view taken along lines 36-36 from FIG. 34;

FIG. 37 is an isometric view of another embodiment of the presentinvention now having a leadwire comprised of different materials;

FIG. 38 is a sectional side view taken along lines 38-38 from FIG. 37;

FIG. 38A is similar to FIG. 38 but is another embodiment of a leadwirecomprised of different materials;

FIG. 39 is a sectional view of a feedthrough having a peninsula with agold pocket pad for an internally ground capacitor;

FIG. 40 is a sectional view similar to FIG. 39 now having an internallyground capacitor placed thereon;

FIG. 41 is a sectional view similar to FIG. 40 now showing an internallygrounded capacitor grounded the oxide-resistant gold braze hermeticseal;

FIG. 42 illustrates a sectional side view of another embodiment of thepresent invention similar to FIG. 41 now having an internally groundedcapacitor that is ground to a gold pocket pad along the ferruleperimeter;

FIG. 43 is very similar to FIG. 42 but now uses an ACF film for makingelectrical connections; and

FIG. 44 is an enlarged view taken along lines 44-44 of FIG. 43.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In some of the following figure descriptions herein, reference axes areincluded to be helpful in understanding the present invention (see forexample FIG. 21). In particular these are orthogonal axes with an x, yand z axis shown in the figures to provide a reference for the reviewerfor increased understanding of the present invention. As used herein,the z axis may also be referred to as the longitudinal axis. Incross-sections the axes will appear as either z, y or z, x axes views,which is consistent with isometric geometry.

FIG. 21A illustrates a rectangular ferrule structure 112 for an AIMDthat is typically made of titanium. As shown herein, the ferrule iswithout an insulator 160 and without leadwires 111. There are fourimaginary planes, as illustrated, extending upward above the ferrule112. These imaginary planes extend from the outermost perimeter edge ofthe ferrule and embody in the y-z axis, ferrule plane FP_(L1) andFP_(L2). There are also two planes extending in the x-z plane and theseare the ferrule with planes FP_(W1) and FP_(W2).

Jumping ahead to FIG. 21F, one can see that an insulator 160 of FIG. 21Dis configured to be installed in the ferrule opening 306. The insulatorhas four passageways that are also known as insulator via holes 316. Asshown, the insulator has a device side end surface 314 which is oppositethe insulator body fluid side end surface 312.

FIG. 21B illustrates a modified ferrule 112, as previously depicted inFIG. 21A. There is a center line CL shown, with an arrow indicating thelateral direction. As can be seen, the lateral direction isperpendicular to the axis of the center line CL. A ferrule inner surface307 is defined as shown. In this embodiment the inner surface 307 isrelatively simply in shape, but it is understood by those skilled in theart that it could comprise numerous surfaces. A ferrule outermostsurface 302, 304 is also indicated. It is understood that in onedirection the outermost surface may be indicated as 302 and in aperpendicular direction the outermost surface may be indicated as 304.Referring again to the ferrule outermost surfaces 302, 304, one can seethat ferrules often have complex shapes, including, in this case,surfaces 303 and 305. For the purposes of the present invention, thatwhich will be the outermost, meaning the surface of the ferrule thatextends in the lateral direction furthest from the center line, isdefined as the ferrule outermost surface 302, 304. Accordingly, thesurfaces 303 and 305 are not the outermost. A ferrule device side endsurface 310 is also defined as shown. The ferrule side wall 309 isdefined as including all of the projections and irregularities of theferrule side wall which would include, in this case, the outermostsurface 302, 304 and other features, such as 303 and 305. In otherwords, the ferrule side wall 309 comprises the entire side wall and allof its features whether outermost or not. The ferrule also has a bodyfluid side end surface 308, as shown. The ferrule also comprises aferrule opening 306, as shown. As is understood by those skilled in theart, the ferrule opening 306 is configured to receive an insulatorstructure 160. Referring once again to FIG. 21B, one will see that thereis an imaginary projection 334 shown projected (perpendicular to surface310) aligned with the ferrule outermost surface 302, 304. This imaginaryprojection 334 is helpful in later figures to understand how afeedthrough capacitor will be disposed in an overhanging relationship tothe ferrule.

FIG. 21C is very similar to FIG. 21B but illustrates that ferrules 112can take on various shapes. In this case, the ferrule outermost surface302, 304 is not necessarily disposed contiguous with the ferrule deviceside end surface. Rather, the ferrule outermost surface 302, 304 isbetween surfaces 303 and 305. Yet, the imaginary ferrule projection 334is from the ferrule outermost surface 302, 304, no matter where itoccurs along the ferrule side wall 309. It is also understood by thoseskilled in the art that ferrules are typically made of titanium and arealways electrically conductive. However, other suitable materials for aferrule are possible as this teaching is not limited to just a titaniumferrule.

302 is defined herein as a first outermost surface but which can also becalled a first outermost edge. Likewise, 304 is defined as a secondoutermost surface but which can also be called as a first outermostedge. It is noted that the surfaces/edges 302 and 304 are perpendicularto each other in the case of a rectangular shaped ferrule.

FIG. 21D shows an alumina ceramic insulator 160 that has been configuredsuch that it will fit into the ferrule opening 306, as previouslydescribed in FIGS. 21A, 21B and 21C. In this particular case, theinsulator has four passageways 316. Referring now to cross-sectionalview 21E-21E taken from FIG. 21D, one can see these passageways areactive passageways meaning that they are going to receive terminal pinsthat pass from a body fluid side to a device side of the AIMD. Again,referring to FIG. 21E, there is an active hole inner surface 318, asshown. The insulator body fluid side end surface 312 is indicated andthe insulator device side end surface 314 is also indicated. In general,when the insulator is installed in a ferrule 112 and the ferrule isinstalled in an AIMD housing 116, the device end surface 314 will be theside that is directed toward the inside of the AIMD housing and theinsulator body fluid side end surface 312 will be that side that isdirected towards the body fluid side of the AIMD.

FIG. 21F illustrates a rectangular quadpolar hermetic feedthrough 120.One can see that there is a ferrule structure 112 that has been goldbrazed 150 to a generally alumina ceramic insulator 160. (The aluminaceramic insulator 160 was previously described in FIGS. 21D and 21E.)There are also four leadwires (i.e. pins or leads) 111, 114 which arealso gold brazed 162 to the alumina insulator 160. It will be noted thatthe through-pins, which are solid conductors, are labeled 111 on thedevice side and 114 on the body fluid side. Accordingly, even thosethese leadwires are solid, they can be described as having a device sideportion 111 and a body fluid side portion 114. As used and definedherein, the word “portion” does not mean that a structure, such as aleadwire, has to have two different parts. Rather, it rather means thatit has two different ends. However, as shown in later figures theleadwire itself may be made from differing materials to save cost.

FIG. 21F also illustrates the feedthrough capacitor 132 coming down andbeing mounted “adjacent” the ferrule 112, such that the feedthroughcapacitor can be directly mounted onto one of the ferrule and/or theinsulator, as previously illustrated in FIG. 4 or it can be spaced awayfrom one of the insulator and the ferrule with an insulative washer 212,as previously illustrated in FIG. 13. The feedthrough capacitor 132could even be spaced away from either the insulator or the ferrule by anair gap. As used herein, the word “adjacent” is not limited to touching,rather “adjacent” includes being right near and/or mounted directly ontoa structure, being spaced from with an air gap or also spaced with awasher there between.

Referring once again to FIG. 21F, the leadwires 111, 114 are alsodefined herein as comprising active conductive pathways that reside inand are hermetically sealed to the insulator 160, in the at least oneactive insulator via hole 316, as previously described in FIG. 21D.Skipping ahead to FIGS. 39-45, the insulator structure 160 may comprisea ceramic reinforced co-sintered metal 185 with platinum co-sintered endcaps 186. The active conductive pathway residing in and hermeticallysealed to the insulator need not always comprise a leadwire as shown inFIG. 21F, but can comprise any of the structure, as defined in any ofthe drawings herein.

FIG. 22 illustrates a rectangular (or could be square, circular,rounded, oval or some combination thereof) feedthrough capacitor 132mounted to the hermetic terminal feedthrough assembly 120 of FIG. 21.The feedthrough capacitor 132 has a unique geometry and for the firsttime, overhangs both sides of the ferrule in the x direction. However,in this embodiment the feedthrough capacitor is designed to not overhangthe ferrule in the y direction. In fact, the y dimension of thefeedthrough capacitor is specifically designed such that the electricalconnection material 152 between the capacitor ground metallization 142and the ferrule will hit the oxide-resistant exposed gold braze 150, asillustrated.

Referring once again to FIG. 22, a global ground electrical connection192 is defined. As defined herein, a ground electrical connection 192,as illustrated in FIG. 22, may comprise a ground electrode plate setelectrically connected to the capacitor ground metallization 142. Then,either a thermal-setting conductive adhesive, or a solder or the like152 is used to electrically connect the capacitor ground metallization142 to the ferrule 112. As previously discussed, ferrule structures 112are typically of titanium and may be oxidized. Accordingly, in thepresent invention, the global electrical connection 192 would includeconnection to the hermetic seal of the gold braze 150, as illustrated,which is an oxide-resistant and bio-stable surface. Alternatively, theglobal electrical connection may be to gold pockets in the ferrule, aswill be described in FIGS. 23 and 23A herein. The global electricalconnection 192 may also comprise one or more internally groundedfeedthrough passageways that will be described in detail herein, inFIGS. 26 and 26A.

Again, the global use of the ground electrical connection orelectrically conductive path 192 may include a hybrid groundedcapacitor, as illustrated in FIG. 28, and is shown attached to a ferrulein FIGS. 31 and 32. This embodiment is known as a hybrid ground in that,one of the feedthrough capacitor passageways is grounded. In otherwords, attached electrically connected to the ground electrode platesand the ground electrode plates are also brought out to externalmetallizations. This hybrid grounding system globally is still called192, but combines exterior electrical metallizations, as well as agrounded passageway.

The novel configuration as illustrated in FIG. 22 illustrates severalimportant principles: 1) an oxide-resistant metal connection 152 is madebetween the ground metallization 142 of the feedthrough capacitor to thegold braze 150; and 2) in the x direction, the feedthrough capacitor isactually wider than the ferrule, which greatly increases the effectivecapacitance area (ECA) of each one of the four filter capacitors. Thepresent invention results in an amazing increase of volumetricefficiency for the device.

Referring once again to FIG. 22, it is not really practical to reversethe geometry, that is, make the capacitor relatively thin in the x axisand overhanging the long in the y axis. The problem with this reversalis that the ECA of each of the four capacitors would be significantlyreduced. It will be appreciated that this could be done under thepresent invention but would not be a preferred embodiment.

A recent driving factor behind having a capacitor overhang in one axis(in this case, the x axis) and not overhang in the y axis has to do withthe need for a oxide-resistant ground electrical connection 192 while atthe same time, increasing the capacitor's ECA. As previously mentioned,with the number of leads constantly increasing, there is a constant needfor improvements in volumetric efficiency, which increased ECA provides.Increasing the ECA also enables the use of lower k dielectrics, such asthose taught by U.S. Pat. Nos. 9,764,129; and 10,092,749, the contentsof which are included in full herein by reference.

FIG. 22A is taken generally from section 22A-22A from FIG. 22. FIG. 22Ais sliced through the capacitor exactly along the perimeter edge (y-zplane) of the ferrule. This is why the ferrule is not showncross-sectioned in FIG. 22A. The internal electrode plates of thefeedthrough capacitor 132 have been exposed, such that one can see theactive electrodes 148 and the ground electrodes 146, which run from oneend of the capacitor to the other in the y direction and are connectedto an external capacitor metallization 142. One can also clearly see theelectrical connection 152 between the capacitor ground metallization 142and the gold braze of the hermetic seal.

FIG. 22B is taken from section 22B-22B of FIG. 22, which is very similarto FIG. 22A, except this time, the section line, which is along the yaxis, goes through two (C₃, C₄) of the active leadwire or lead pins. Onecan see that there are two sets of active electrodes 148 and 148′, whichare each conductively connected to the two associated leadwires. It willbe understood that there are actually four sets of active electrodeplates with two other sets being associated with the two other leads(C₁, C₂) through which the section does not pass. Also shown is theground electrode plate 146, again, connecting from ground metallization142 on each end of the capacitor. Referring once again to FIGS. 22A and22B, it will be appreciated that both ends of the capacitor groundmetallization 142 are connected with an electrical connection material152 to sections of the hermetic seal gold braze 150, as illustrated. Inthis view, the metallization and gold braze is not shown on theinsulator for simplicity.

Referring again to FIG. 22B and as defined herein, there is a firstelectrical connection material 156 that connects the active conductivepathway residing in the at least one active via hole in the insulator tothe active metallization electrically connected to the at least oneactive electrode plate of the feedthrough capacitor. Also defined is asecond electrical connection material 152 that electrically connects thecapacitor ground metallization 142 connected to the at least one groundelectrode plate of the feedthrough capacitor to the ferrule. Thesedefinitions do not mean that the electrical connection material 152 isconnected only to the ferrule but can be connected to the ferrulethrough an intermediate material, such as a gold braze and the like, aspreviously described.

FIG. 22C is taken from section 22C-22C from FIG. 22 and is a sectionalview generally taken along the x axis through pins C₁ and C₄. In thisview, one can clearly see how the quadpolar feedthrough capacitor 132overhangs the perimeter edges of the ferrule in the x direction. One canclearly see the active electrode plates 148′ and in this case, 148″,each associated with a leadwire 111.

FIG. 22C better illustrates two of the via holes in cross-section. Onecan see that the via holes 316 have an active via hole inner surface 318as best seen in FIG. 21E. This active via hole inner surface 318 mightbe sputtered (metallized) after the insulator 160 is sintered, such thatthere is an adhesion layer 153 and wetting layer 151 suitable to accepta gold braze. In other embodiments, the passageway 316 may be filled bya substantially pure platinum via or a ceramic reinforced metalcomposite, as will be further described herein. In these cases, theconductive via passageway 316 would be co-sintered at the same time asthe alumina insulator 160.

There is an active conductive pathway 320 that is formed through theinsulator structure. This active conductive pathway can take the form ofa leadwire, as illustrated in FIGS. 4, 9, 13 or it may take the form ofany of the substantially pure platinum or ceramic reinforced metalcomposite co-sintered vias, as illustrated in FIGS. 39-45. Referring nowback to FIG. 22C, one can see that the feedthrough capacitor has adevice side end surface 324 and a side of the capacitor 326 that is nearor adjacent the ferrule. There is at least one active passageway 328extending through the capacitor dielectric between the capacitor firstand second surfaces 324 and 326. It will be appreciated that thisconductive passageway, in many embodiments, extends outwardly beyondeither capacitor surface 324, 326 or both. Also, the conductive pathwaymay extend beyond at least one of the ferrule device side or the ferrulebody fluid side or both.

FIG. 22D is taken from 22D-22D from FIG. 22 and is very similar to FIG.22C, except in this case, it does not cut through any of the activeleadwire pins. This sectional cut is also taken in the margin areabetween active electrodes 148, such that none of the active electrodesare shown in FIG. 22D. Accordingly, the only electrodes that we can seein this view are ground electrodes 146. In FIG. 22D, one can see one ofthe novel aspects of the present invention that is where the capacitoroverhangs the ferrule and where the ground electrodes 146 do not need toextend to the outer edges of the feedthrough capacitor. These outeredges are the parts of the overhanging capacitor in the y-z plane thatoverhang the ferrule.

FIG. 22E is a side view taken from isometric 22E-22E from FIG. 22. Thisis not a sectional view but illustrates the overhanging capacitor 132.As properly noted in FIG. 22E, this is drawn in the x-z plane. Theperimeter edge of the ferrule is illustrated by line A-A. Line A-A isbest thought of as a plane that goes in and out of the paper along theperimeter edge of the ferrule, as illustrated. One can clearly see thepresent invention in FIG. 22E, as the overhang 200, which overhangs lineA-A. As illustrated in FIG. 22E, this overhang 200′, 200″ is on bothsides. It will be appreciated that the overhang could be only on oneside, but this would reduce the effective capacitance area of the twoassociated leadwires that are not on the overhanging side.

FIG. 22F is another side view taken from isometric 22F-22F from FIG. 22.Again, in this case, there is no cross-hatching, and this shows the sideview taken in the y-z plane. Again, an imaginary line B-B is shown alongthe edge of the capacitor which could also be thought of as a planeextending into and out of the paper. Importantly, in accordance with thepresent invention, there is a setback (spaced inwardly) 201′ and 201″,as illustrated. As will be seen in every embodiment, the setback 201also enables an oxide-resistant conductive connection to the ferrule. Insummary, the FIG. 22 series illustrates the present invention, in that,there is always a portion of the feedthrough capacitor perimeter thatoverhangs the ferrule (which increases the ECA) and there is also alwaysa portion of the feedthrough capacitor perimeter that is setback (doesnot overhang) a portion of the ferrule perimeter or is aligned with theferrule perimeter. In general, this setback area enables anoxide-resistant electrical connection generally to a gold or other noblesurface.

Referring once again to FIGS. 22E and 22F, one can see that there is aline C-C, which in both cases can become a plane by imagining itextended in and out of the paper. This is the plane between thecapacitor 132 and the ferrule and insulator 112, 160. It will beappreciated that the capacitor may lay directly against the insulator,the ferrule or both the insulator and the ferrule, or even that thecapacitor may be spaced some distance away from the insulator and/or theferrule by means of an adhesive washer, a spacer, an air gap or thelike. Referring once again to FIG. 22E, one will also appreciate that inthe present invention, the capacitor overhang area 200 may coincidesubstantially with line or plane A-A. By aligning the capacitor overhangedge 200 with the perimeter edge of the ferrule A-A, one still gains asubstantial amount of ECA. Importantly, it is still necessary to have asetback 201, as illustrated in FIG. 22F, so that one can accomplish anoxide-resistant electrical ground connection 152.

Referring back to the imaginary projections of FIG. 21A, the imaginaryprojection planes FPL1, FPL2, FPW1 and FPW2 onto the capacitordielectric second end surface 326 defines: at least one capacitordielectric imaginary first overhang portion 200′ or 200′ or both 200′ or200′ extending laterally outwardly beyond the ferrule outmost surface302; and a capacitor dielectric imaginary second overlay portion 203that overlays the ferrule device side end surface and overlays thehermetically sealed insulator, wherein, at least part of the capacitordielectric outer side wall in the capacitor dielectric imaginary secondoverlay portion is spaced inwardly 201′ or 201″ from the ferruleoutermost surface 304 and wherein, the at least one ground electrodeplate at least partially resides in the capacitor dielectric imaginarysecond overlay portion.

FIG. 22G is very similar to FIG. 22, except that the feedthroughcapacitor 132 only overhangs the ferrule 112 on one side, asillustrated. This is best illustrated in FIG. 22H where one can see thatthe feedthrough capacitor overhang portion 330 only overhangs on theright side of the ferrule and not the left side.

FIG. 22I is essentially the same as FIG. 22F, which illustrates that thefeedthrough capacitor is spaced inwardly on both the right and the leftsides from the ferrule outermost surface 304.

FIG. 22J is very similar to FIG. 22H, except on the left side, thecapacitor is aligned with the ferrule outermost surface 302, asindicated. So, in this case, the ferrule is overhanging on the rightside 330 and is aligned on the left side.

FIG. 22K is exactly the same as FIG. 22I because from this perspective,they are both the same.

FIG. 22L illustrates the active electrode plates of the capacitorillustrated in FIGS. 22 and 22E. One can see that the active electrodesof all four of the quad polar capacitors are equal in this view.

FIG. 22M illustrates the active electrodes of the feedthrough capacitorof FIG. 22H that only overhangs on one side. The overhang on the oneside makes the active electrodes on that side much larger and hence thecapacitor value is larger. By only overhanging on one side, however, theeffective capacitance area where active electrode plates become smaller.Referring once again to FIG. 22H, this means that the capacitors for theleadwires on the left is lower than the capacitance for the leadwires111 on the right.

FIG. 22N illustrates the active electrode plates taken from FIGS. 22Jand 22K. In this case, the four-quad polar leadwires are inline. Again,because the capacitor is overhanging on one side and not the other, thisresults in asymmetry of the active electrode plates, as indicated. Thisasymmetry is not a disadvantage in that, the effective capacitance areaor electrode plate area is equal for all four of the active electrodes.

FIGS. 22O through 22W indicate various alignments of the capacitor 132(shown with a solid line) as it overlays the top view of the ferrule 112(indicated by the dash lines). In accordance with the present invention,as illustrated in FIG. 22O, the feedthrough capacitor need only overhangone side or portion of the ferrule. It is also important that thecapacitor be set back or not overhang at least a portion of the ferrule.

In particular FIG. 22R illustrates perhaps the most likely form of thepresent invention wherein, the feedthrough capacitor overhangs oppositesides of the ferrule and is held back or set back from the other twosides of the ferrule. This allows for a proper ground attachment to agold braze and in turn, to the ferrule while at the same time, allowsfor the resulting active electrode plates to all be equal and therefore,result in equal filter performance for each of the leads. Having equalfilter performance on each of the leads is the common practice in theAIMD industry.

FIG. 23 is an isometric view of a hermetic seal subassembly 120 similarto that previously described in FIG. 21F. As one can see, there is agold braze 150 between ferrule 112 and insulator 160. It will beappreciated that one can only extend this gold braze 150 outwardly somuch before it would interfere with the can half clam shell matingstructure 163. One can see that four novel gold-filled pockets 248 (250)have been formed. In general, these pockets are like little swimmingpools that are machined at the time that the ferrule 112 is formed. Thenat the same time that gold brazes 150 and 162 are formed, then goldpreforms 250 are reflowed thereby, creating four oxide-resistant noblemetal attachment surfaces.

Referring back to FIG. 23, it will be appreciated that the gold pockets248, 250 can be joined on each end into a trough into which a smalldiameter gold wire is placed prior to gold brazing. This is bestillustrated in FIG. 23A, which is taken from section 23A-23A from FIG.23. Shown is a small diameter gold wire 250 ready to be placed into anelongated gold pocket receptacle 248. In general, gold braze 250 isreflowed at the same time that the hermetic seal gold brazes 150 and 162are formed. Alternatively, wire 250 may comprise an oxide-resistantmetal addition such as a brazed or laser welded gold, platinum,palladium, silver, and combinations thereof. Additionally, the wire 250may further comprise a clip, a pad, an L-shaped pad, and an L-shaped padwith cutouts. Wire 250 may comprise any of the metal additions describedin U.S. Pat. No. 9,931,514, the contents of which are incorporated fullyherein by reference.

FIG. 23 was taken from FIG. 25 of U.S. patent application Ser. No.15/943,998, the contents of which are incorporated in full herein. Amajor advantage of these pocket pads is that much less gold braze isrequired to form the hermetic seal 150 between the ferrule 112 andinsulator 160. In addition, the gold pocket pads are so thin that theycan be placed right over the can capture area 163.

FIG. 24 illustrates a quadpolar feedthrough capacitor 132 mounted to thehermetic seal with gold pocket pads of FIG. 23. This allows thefeedthrough capacitor to be wider CW₁. In accordance with the presentinvention, the feedthrough capacitor 132 overhangs the outermostperimeter of the ferrule FW₁ as indicated. This is known as thecapacitor overhang area. This capacitor overhang area is generallyoriented in the x direction. When one looks at the y direction, one willsee that the capacitor 132 is setback from the edge of the ferruleperimeter. In other words, dimension CW₂ is either less than orsubstantially equal to FW₂. In summary, in accordance with the presentinvention, the feedthrough capacitor of FIG. 24 overhangs in the xdirection and is setback (or aligned) in the y direction. Also, inaccordance with the present invention, an oxide-resistant electricalconnection 142 is made between the feedthrough capacitor groundmetallization 142 and each of the four-gold pocket pad 248, 250 asindicated with electrical connection material 152. It will beappreciated that the number of gold pocket pads can be increased,decreased or even merged together. It will also be appreciated that theelectrical connection material 152 can comprise thermal-settingconductive adhesive, a solder, a braze or the like.

FIG. 24A is taken from section 24A-24A from FIG. 24. FIG. 24Aillustrates that the feedthrough capacitor 132 is setback on both of itssides from the ferrule width FW₂. This is also illustrated in FIG. 24B.

FIG. 24C is a side view taken from 24C-24C from FIG. 24. This is verysimilar to FIG. 22E, except that the electrical connections are to thegold pockets and not to the hermetic seal gold braze.

FIG. 24D is a side view taken from 24D-24D from FIG. 24. This figure isvery similar to FIG. 22F and illustrates that the capacitor is setbackin its width from the ferrule. In summary, FIG. 24C illustrates the side(pictorial) view in the x-z plane clearly illustrating that thefeedthrough capacitor 132 overhangs 200 ferrule 112. As mentioned inFIG. 24D, the capacitor can be substantially aligned with the edge ofthe ferrule or setback 201, as illustrated.

FIG. 25 is an internally grounded capacitor with a ferrule peninsula139. An internally grounded capacitor with a ferrule peninsula is taughtin FIGS. 11a, 11b and 11c in U.S. patent application Ser. No.15/863,194, the contents of which are incorporated herein fully bereference. Referring back to FIG. 25, one can see that in the x-zdirection, the feedthrough capacitor 132 overhangs the ferrule 112.

This is best illustrated in FIG. 26, where one can see the feedthroughcapacitor mounted to the ferrule wherein, it clearly overhangs the widthof the ferrule in the x-z plane. It will also be noted that thisfeedthrough capacitor, since it is internally grounded, has no externalor perimeter electrical metallization or electrical connection to theferrule. The entire grounding of the feedthrough capacitor internalground electrodes are through internal ground leadwire 111gnd.Accordingly, the feedthrough capacitor is also not constrained in they-z orientation either. In this case, the feedthrough capacitor is shownnearly aligned with the outermost edge of the length of the ferrule andoverhang substantially along the width of the ferrule.

FIG. 26A is taken from section 26A-26A from FIG. 26. FIG. 26A is drawnin the x-z plane clearly showing how the internally grounded feedthroughcapacitor 132 overhangs the widest width of the ferrule 112. FIG. 26A issectioned through one of the active pins 111 and shows that it iselectrically connected 156 to active metallization 144, which isconnected to its active electrode plates 148, as shown.

FIG. 26B is taken from section 26B-26B from FIG. 26 and is very similarto FIG. 26A, except that this is sectioned through the ground pin111gnd. One can see that the ground pin is gold braze 150′ into theferrule 122 peninsula structure 139 as indicated. FIG. 26B also showsthat the grounded pin 111gnd is connected to the corresponding set ofcapacitor ground electrode plates 126.

FIG. 26C is very similar to FIGS. 26A and 26B and is taken generallyfrom section 26C-26C from FIG. 26. In this case, the sectioning isthrough ground pin 111gnd. In this embodiment, instead of a ferrulepeninsula, there is a ferrule bridge, as now illustrated. Referring backto FIG. 26, the bridge concept for an internal ground pin is illustratedin FIG. 40 of U.S. Pat. No. 6,765,780, the contents of which areincorporated herein fully be reference.

FIG. 26D is taken from section 26D-26D from FIG. 26 and illustrates anactive pin and an insulator 160′ that is either a fusion glass, acompression glass or a glass ceramic. In this case, there is no need fora gold braze between the ferrule and the insulator.

FIG. 27 is an electrical schematic diagram of the feedthrough capacitorfilter of FIG. 26, which illustrates that the ground pin 111gnd onlyextends to the device side (not to the body fluid side). Active pins 111a through 111 h are illustrated, each associated with its own individualfeedthrough capacitor. In addition, a telemetry pin T is illustrated,which cannot be filtered. If the telemetry pin were filtered, then itwould not be possible to transmit RF telemetry signals back and forthfrom the device.

FIG. 28 illustrates a hybrid feedthrough capacitor, which is bestunderstood by looking at its ground electrode plates in FIG. 29 and itsactive electrode plates in FIG. 30. Ground electrode plate in FIG. 28,which is taken from section 29-29 from FIG. 28. This illustrates aground electrode that is grounded to a center hole 111gnd and also atits ends, as illustrated. The ends of the capacitor ground electrodesare terminated in capacitor metallization 142. There are eight activeelectrodes forming eight different capacitors, as illustrated in FIG.30. FIG. 30 is taken generally from section 30-30 from FIG. 28. Theactive electrodes 148 are all the same size, which would mean that allof the capacitances were of equal value. It is known to those skilled inthe art to vary the active areas if different capacitance were required.

FIG. 31 illustrates a hermetic seal terminal subassembly 120 that hasbeen prepared for mounting of the feedthrough capacitor of FIG. 28. Onecan see a center ground pin 111gnd, which is either laser welded to goldbraze 150′ to the ferrule structure 112. In addition, there are gold padpockets 248, 250. On the left-hand side, these are shown as two discretepockets and on the right-hand side, this is shown as one continuouspocket. The feedthrough capacitor 132 of FIG. 28 is defined herein as ahybrid internally grounded capacitor, in that, it has both an internalground passageway and also grounded end metallizations. Hybridcapacitors are taught by U.S. Pat. No. 6,765,780, the contents of whichis fully incorporated herein with this reference.

Referring back to FIG. 31, the gold pockets 250 are optional, in that,if the capacitor was made shorter, an electrical contact 152 could bemade to the gold braze 150 of the hermetic seal. However, asillustrated, the gold pockets allow the capacitor to be a little longerand extend over complex ferrule areas, including ferrule capture areas163. These multipart pins are taught by U.S. patent Ser. Nos. 15/844,683and 15/603,521, the contents of which are incorporated herein fully bereference.

FIG. 32 illustrates the hybrid capacitor 132 of FIG. 28 mounted to thefeedthrough hermetic seal subassembly 120 of FIG. 31. In accordance withthe present invention and as illustrated in FIG. 32, the width of thefeedthrough capacitor 268 overhangs the widest dimension of the ferrule266. Also, in accordance with the present invention, the length of thefeedthrough capacitor 272 is setback (it is shorter) from the overalllength or the greatest length of the ferrule 270. Accordingly, thecapacitor perimeter width surfaces 252 overhang the ferrule inaccordance with the present invention.

FIG. 33 is taken from section 33-33 from FIG. 32 and shows theoverhanging capacitor in sectional view. FIG. 33 is taken in the y-zplane and illustrates that the capacitor sets back (does not overhang)the widest dimensions of the ferrule 112. Referring once again to FIG.33, one can clearly see the electrical connection 152 between theinternally grounded hybrid feedthrough capacitor ground metallization142 and gold pockets 250. In FIG. 33, one can also see ground pin111gnd, which has been gold brazed 150′ into ferrule bridge 141. Thistype of hybrid grounding, using both the end metallizations 142 and theground pin 111gnd is very important, such that proper filter performancebe maintained on every one of the active pins. This capacitor is toolong to depend only on grounding by the centered pin 111gnd. Undueinductance and resistance could build up along the ground electrodeplates, meaning that the furthest left and furthest right pins wouldhave seriously degraded insertion loss (attenuation). In accordance withthe hybrid concept, what results is a multi-point ground system, whichmeans that each pin is an effective EMI filter. Hybrid internallygrounded capacitors are taught by U.S. Pat. No. 6,765,780, the conceptsof which are incorporated fully herein by reference.

Referring to FIG. 34, one will notice that the gold pockets 248, 250have been eliminated. In this case, the capacitor length is aligned sothat an electrical connection can be made from the capacitor groundmetallization 142 directly to the gold braze of the hermetic sealbetween the insulator 160 and ferrule 112.

FIG. 35 is a top view of the capacitor mounted onto the hermeticterminal subassembly of FIG. 34. In accordance with the presentinvention, one can see that the overall length 272 of the hybridinternally grounded feedthrough capacitor 132″ is shorter (has asetback) compared to the greatest overall length of the ferrule 270.Also, in accordance with the present invention is the hybrid internallygrounded feedthrough capacitor 132″ is wider in its width than thegreatest width 266 of the ferrule 266. The greatest width 266 of theferrule is also known as the furthermost width of the ferrule. Asillustrated in FIG. 34, ferrules 112 often have irregular dimensions, soit is important that when we refer to capacitor overhang or capacitorsetback, we are always referring to the greatest width or the greatestlength of both an irregularly shaped ferrule and/or a regularly shaped(symmetrical) ferrule.

FIG. 36 is a cross-sectional view taken from section 36-36 from FIG. 35.This illustrates the centered ground pin 111gnd which has been goldbrazed or laser welded 150′ into the ferrule peninsula structure 139.The hybrid ground connections are also shown in the capacitor groundterminations 142 are shown electrically connected 152 to ferrule goldbraze 150. As previously described, this multi-point grounding systemassures a high level of filtering performance for each of the activepins.

FIG. 37 is a quadpolar capacitor somewhat similar to that illustrated inFIGS. 21 and 22. As illustrated, it has an overhang and also a setbackin accordance with the present invention. Another distinguishing featureis revealed in FIG. 38, which is taken from section 38-38 from FIG. 37.On the left-hand side of the sectional view, one can see that the deviceside leadwire 111 has been segmented (complete wire segment 117).Leadwire segment 117 has been co-brazed along with body fluid side lead114′. This is defined herein as a two-part pin. The right-hand side ofFIG. 38 illustrates that the body fluid side pin 114 extends all the waythrough the hermetic insulator and half way through the feedthroughcapacitor. In both the left and right-hand side embodiments, there is alow-cost pin 111, which is typically of tin copper, which is co-joinedand soldered approximately half way through the feedthrough capacitor.This type of two-part or three-part pin construction greatly reducescost because in the prior art, it was typical to take non-toxic andbiocompatible leadwires, such as platinum or palladium leadwires and runthem all the way through the structure. There is no need on the deviceside to have biocompatible materials.

Referring back to FIG. 38, on the left-hand side, we have a co-brazedpin, which is further described by U.S. patent application Ser. No.15/603,521, the contents of which are incorporated herein fully byreference. On the right-hand side of FIG. 41, we have a two-part pinco-joined in the feedthrough capacitor that is described by U.S. patentapplication Ser. No. 15/844,683, the contents of which are also fullyincorporated herein by reference.

FIG. 38A is substantially the same as FIG. 38, except in this case, thetwo-part lead connection is disposed inside the inside insulatorpassageway, as illustrated. In this case, the two-part lead 111′, 114 isjoined by co-brazing the leads. Two-part pins, as illustrated in FIG.38A, are more thoroughly described in U.S. Patent Pub. No. 2018/0126175(application Ser. No. 15/603,521), the contents of which are hereinincorporated by reference.

FIG. 39 illustrates a cross-section of a hermetic terminal subassemblywith a peninsula with a gold pocket. It also illustrates that instead ofa leadwire pin, a conductive pathway passes through the insulator. Inthis case, the conductive pathway consists of a ceramic reinforced metalcomposite material 185 with pure platinum end caps 186. Referring toFIGS. 39-45, composite reinforced metal ceramic (CRMC) co-sintered viasare more fully described in U.S. patent application Ser. No. 15/863,194,the contents of which are incorporated herein fully be reference. CRMCvias are also described in U.S. Pat. Nos. 8,653,384; 8,938,309;9,233,253; 9,352,150; 9,492,659; and 9,889,306, the contents of whichare incorporated herein by reference.

FIG. 40 illustrates an internally grounded feedthrough capacitor 132′ ofthe present invention mounted to the hermetic terminal and substantiallyoverhanging the ferrule 112. This overhang is in the x-z axis. Not shownis the sectional view from the side showing the length of thefeedthrough capacitor and the length of the ferrule, but it will beappreciated that the capacitor does not overhang in the y-z axis, but itis either setback or aligned with the ferrule edge as has beenpreviously described.

FIG. 41 is substantially the same as FIG. 40, except in this caseinstead of gold pockets, the ground electrical connections from the twoground pins 119gnd are directly to the hermetic seal gold braze 150 byway of 202gnd, which can be a solder, a thermal-setting conductiveadhesive, ACF film or the like. Again, in accordance with the presentinvention, the feedthrough capacitor 132′ overhangs the ferrule in thex-z plane.

FIG. 42 is similar to FIG. 40 illustrating the present invention with aninternally grounded feedthrough capacitor 132′ along with multipleconnections to gold pockets 250 and 250′ In accordance with the presentinvention, the internally grounded feedthrough capacitor 132 overhangsthe widest width of the ferrule 112 in the x-z plane.

FIG. 43 is very similar to FIGS. 41 and 42, except that in this case,ACF films are used to make the electrical connection 260 and anail-headed ground leadwire 111gnd, as illustrated. It will beappreciated that in addition to ACF films, BGA solder bumps or BGAthermal-setting epoxy bumps could also be used.

FIG. 44 is a close-up taken from section 44-44 from FIG. 43 illustratingcompression of the ACF film conductive particles 262′ in the electricalconnection area. The freely suspended particles 262 are insulated fromeach other providing conductivity only on the area of the nail head111gnd nail head 260 and gold pocket area 250 of ferrule 112.

What is claimed is:
 1. A filter feedthrough that is attachable to anactive implantable medical device (AIMD), the filter feedthroughcomprising: a) a feedthrough, comprising: i) an electrically conductiveferrule comprising a ferrule sidewall extending to a ferrule body fluidside end surface and to a ferrule device side end surface, the ferrulesidewall further comprising a ferrule outermost surface and a ferruleinner surface defining a ferrule opening extending to the ferrule bodyfluid and device side end surfaces, wherein, when the ferrule isattached to an opening in a housing of an AIMD, the ferrule body fluidside end surface and the ferrule device side end surface reside outsidethe AIMD and inside the AIMD, respectively; ii) an insulator at leastpartially residing in the ferrule opening where the insulator ishermetically sealed to the ferrule, the insulator extending to aninsulator body fluid side end surface and to an insulator device sideend surface; iii) at least one active via hole extending through theinsulator to the insulator body fluid and device side end surfaces; andiv) an active conductive pathway at least partially residing in andhermetically sealed to the insulator in the at least one active viahole; and b) a feedthrough capacitor disposed on or near the ferruledevice side end surface or the insulator body fluid side end surface ofthe ferrule, the feedthrough capacitor comprising: i) a capacitordielectric having a capacitor dielectric outer sidewall extending to acapacitor dielectric first end surface and to a capacitor dielectricsecond end surface; ii) at least one active electrode plate interleavedin a capacitive relationship with at least one ground electrode plate inthe capacitor dielectric; iii) at least one active passageway extendingthrough the capacitor dielectric to the capacitor dielectric first andsecond end surfaces; iv) a capacitor active metallization contacting thecapacitor dielectric in the at least one active passageway and beingelectrically connected to the at least one active electrode plate; andv) a capacitor ground metallization electrically connected to the atleast one ground electrode plate; and c) a first electrical connectionmaterial electrically connecting the active conductive pathway residingin the at least one active via hole in the insulator to the capacitoractive metallization electrically connected to the at least one activeelectrode plate of the feedthrough capacitor; and d) a second electricalconnection material electrically connecting the capacitor groundmetallization electrically connected to the at least one groundelectrode plate of the feedthrough capacitor to the ferrule, e) whereinan imaginary projection of the ferrule outermost surface onto thecapacitor dielectric second end surface defines: A) at least onecapacitor dielectric imaginary first overhang portion extendinglaterally outwardly beyond the ferrule outermost surface; and B) acapacitor dielectric imaginary second overlay portion that overlays theferrule device side end surface and overlays the insulator device sideend surface, C) wherein at least part of the capacitor dielectric outersidewall in the capacitor dielectric imaginary second overlay portion isspaced inwardly from the ferrule outermost surface, and wherein the atleast one ground electrode plate at least partially resides in thecapacitor dielectric imaginary second overlay portion.
 2. The filterfeedthrough of claim 1, wherein at least a portion of the capacitorground metallization contacts the capacitor outer sidewall in thecapacitor dielectric imaginary second overlay portion and iselectrically connected to the ferrule by the second electricalconnection material.
 3. The filter feedthrough of claim 1, wherein thesecond electrical connection material electrically connects thecapacitor ground metallization electrically connected to the at leastone ground electrode plate of the feedthrough capacitor to at least oneof the ferrule and a first gold braze hermetically sealing the insulatorto the ferrule.
 4. The filter feedthrough of claim 3, wherein: a) theferrule device side end surface is provided with at least one recessedpocket residing adjacent to the outer sidewall of the capacitordielectric imaginary second overlay portion, the recessed pocket havinga gold pocket-pad nested therein and being electrically connected to theferrule, and b) the second electrical connection material electricallyconnects the capacitor ground metallization electrically connected tothe at least one ground electrode plate at least partially residing inthe capacitor dielectric imaginary second overlay portion to the goldpocket-pad.
 5. The filter feedthrough of claim 1, wherein: a) theferrule outermost surface comprises opposed ferrule first and secondoutermost surface portions meeting opposed ferrule third and fourthoutermost surface portions; and b) the capacitor dielectric outersidewall comprises opposed capacitor dielectric first and second outersidewall portions meeting opposed capacitor dielectric third and fourthouter sidewall portions, c) wherein the imaginary projection of theferrule outermost surface onto the capacitor dielectric second endsurface provides the ferrule first and second outermost surface portionsintersecting the capacitor dielectric third and fourth outer sidewallportions to thereby provide: A) the at least one capacitor dielectricimaginary first overhang portion comprising the capacitor dielectricfirst outer sidewall portion extending laterally outwardly beyond theferrule first outermost surface portion; B) the capacitor dielectricimaginary second overlay portion overlaying the ferrule device side endsurface and the insulator device side end surface; and C) a capacitordielectric third overhang portion comprising the capacitor dielectricsecond outer sidewall portion extending laterally outwardly beyond theferrule second outermost surface portion, and d) wherein the imaginaryprojections of the ferrule third and fourth outermost surface portionsdo not intersect the capacitor dielectric third and fourth outersidewall portions to thereby expose portions of the ferrule device sideend surface adjacent to the respective capacitor dielectric third andfourth outer sidewall portions.
 6. The filter feedthrough of claim 5,wherein the ferrule first and second outermost surface portions arelonger than the ferrule third and fourth outermost surface portions tothereby provide the ferrule having a first rectangular shape inplan-view, and wherein the capacitor dielectric first and second outersidewall portions are longer than the capacitor dielectric third andfourth outer sidewall portions to thereby provide the capacitordielectric having a second rectangular shape in plan-view.
 7. The filterfeedthrough of claim 5, wherein the capacitor ground metallizationcontacts at least one of the capacitor dielectric third and fourth outersidewall portions, and wherein the second electrical connection materialelectrically connects the capacitor ground metallization to the ferruledevice side end surface, spaced inwardly from a corresponding one of atleast one of the ferrule third and fourth outermost surface portions. 8.The filter feedthrough of claim 7, wherein the ferrule device side endsurface is provided with at least one recessed pocket residing adjacentto at least one of the ferrule third and fourth outermost surfaceportions, the recessed pocket having a gold pocket-pad nested thereinand being electrically connected to the ferrule, and wherein thecapacitor ground metallization contacts at least one of the capacitordielectric third and fourth outer sidewall portions with the secondelectrical connection material electrically connecting the capacitorground metallization to the gold pocket-pad.
 9. The filter feedthroughof claim 1, wherein: a) the ferrule outermost surface comprises opposedferrule first and second outermost surface portions meeting opposedferrule third and fourth outermost surface portions, the ferrule firstand second outermost surface portions being linear and the ferrule thirdand fourth outermost surface portions having a radiused shape to therebyprovide the ferrule having a first oval shape in plan-view; and b) thecapacitor dielectric outer sidewall comprises opposed capacitordielectric first and second outer sidewall portions meeting opposedcapacitor dielectric third and fourth outer sidewall portions, thecapacitor dielectric first and second outer sidewall portions beinglinear and the capacitor dielectric third and fourth outer sidewallportions having a radiused shape to thereby provide the capacitordielectric having a second oval shape in plan-view, c) wherein theimaginary projection of the ferrule outermost surface onto the capacitordielectric second end surface provides the ferrule first and secondoutermost surface portions intersecting the capacitor dielectric thirdand fourth outer sidewall portions to thereby provide: A) the capacitordielectric first overhang portion comprising the capacitor dielectricfirst outer sidewall portion extending laterally outwardly beyond theferrule first outermost surface portion; B) the capacitor dielectricimaginary second overlay portion overlaying the ferrule device side endsurface and the insulator device side end surface; and C) a capacitordielectric third overhang portion comprising the capacitor dielectricsecond outer sidewall portion extending laterally outwardly beyond theferrule second outermost surface portion, and d) wherein the imaginaryprojections of the ferrule third and fourth outermost surface portionsdo not intersect the capacitor dielectric third and fourth outersidewall portions to thereby expose portions of the ferrule device sideend surface adjacent to the respective capacitor dielectric third andfourth outer sidewall portions.
 10. The filter feedthrough of claim 9,wherein the capacitor ground metallization contacts at least one of thecapacitor dielectric third and fourth outer sidewall portions, andwherein the second electrical connection material electrically connectsthe capacitor ground metallization to the ferrule device side endsurface, spaced inwardly from at least one of the ferrule third andfourth outermost surface portions.
 11. The filter feedthrough of claim10, wherein the ferrule device side end surface is provided with atleast one recessed pocket residing adjacent to at least one of theferrule third and fourth outermost surface portions, the recessed pockethaving a gold pocket-pad nested therein and being electrically connectedto the ferrule, and wherein the capacitor ground metallization contactsat least one of the capacitor dielectric third and fourth outer sidewallportions with the second electrical connection material electricallyconnecting the capacitor ground metallization to the gold pocket-pad.12. The filter feedthrough of claim 1, further comprising: a) at leastone ground passageway extending through the capacitor dielectric to thecapacitor dielectric first and second end surfaces, the capacitor groundmetallization residing in the ground passageway and being electricallyconnected to the at least one ground electrode plate; b) a peninsulaextending from the ferrule inner surface inwardly into the ferruleopening, wherein the second electrical connection material electricallyconnects the capacitor ground metallization electrically connected tothe at least one ground electrode plate of the feedthrough filter to theferrule peninsula, and c) wherein the ferrule outermost surfacecomprises opposed ferrule first and second outermost surface portionsmeeting opposed ferrule third and fourth outermost surface portions; andd) the capacitor dielectric outer sidewall comprises opposed capacitordielectric first and second outer sidewall portions meeting opposedcapacitor dielectric third and fourth outer sidewall portions, e)wherein the imaginary projection of the ferrule outermost surface ontothe capacitor dielectric second end surface provides the ferrule firstand second outermost surface portions intersecting the capacitordielectric third and fourth outer sidewall portions to thereby providethe capacitor dielectric first overhang portion comprising the capacitordielectric first outer sidewall portion extending laterally outwardlybeyond the ferrule first outermost surface portion, a capacitordielectric imaginary second overlay portion overlaying the ferruledevice side end surface and the insulator device side end surface, and acapacitor dielectric third overhang portion comprising the capacitordielectric second outer sidewall portion extending laterally outwardlybeyond the ferrule second outermost surface portion, and f) wherein theimaginary projections of the ferrule third and fourth outermost surfaceportions do not intersect the capacitor dielectric third and fourthouter sidewall portions to thereby expose portions of the ferrule deviceside end surface adjacent to the respective capacitor dielectric thirdand fourth outer sidewall portions, and g) wherein the capacitor groundmetallization also contacts the capacitor dielectric third and fourthouter sidewall portions, and wherein the second electrical connectionmaterial also electrically connects the capacitor ground metallizationto the ferrule device side end surface, spaced inwardly from the ferrulethird and fourth outermost surface portions.
 13. The filter feedthroughof claim 12, wherein the ferrule first and second outermost surfaceportions are longer than the ferrule third and fourth outermost surfaceportions, and the capacitor dielectric first and second outer sidewallportions are longer than the capacitor dielectric third and fourth outersidewall portions.
 14. The filter feedthrough of claim 1, wherein theactive conductive pathway in the insulator comprises a metallic leadwireresiding in the at least one active via hole where a gold brazehermetically seals the leadwire to the insulator.
 15. The filterfeedthrough of claim 14, wherein the leadwire extends to a leadwire bodyfluid side portion extending outwardly beyond the insulator body fluidside end surface and a leadwire device side portion extending outwardlybeyond the insulator device side end surface, the leadwire device sideportion residing in the at least one active passageway in the capacitordielectric where the leadwire is electrically connected to the at leastone active electrode plate of the feedthrough capacitor.
 16. The filterfeedthrough of claim 1, wherein the at least one active via hole in theinsulator is defined by an active via hole inner surface extending alonga longitudinal axis to the insulator body fluid and device side endsurfaces, and wherein the active conductive pathway residing in the atleast one active via hole comprises: a) a layer of a ceramic reinforcedmetal composite (CRMC) comprising a mixture of alumina and platinum thatcontacts the active via hole inner surface, the layer of CRMC extendingfrom a CRMC first end residing at or adjacent to the insulator deviceside end surface to a CRMC second end residing at or adjacent to theinsulator body fluid side end surface, wherein an inner surface of theCRMC is spaced toward the longitudinal axis with respect to the via holeinner surface; and b) a substantially pure platinum material thatcontacts the CRMC inner surface, the substantially pure platinummaterial extending from a substantially pure platinum material first endresiding at or adjacent to the insulator device side end surface to asubstantially pure platinum material second end residing at or adjacentto the insulator body fluid side end surface.
 17. The filter feedthroughof claim 16, wherein the CRMC first and second ends and thesubstantially pure platinum material first and second ends extend to therespective insulator body fluid and device side end surfaces.
 18. Thefilter feedthrough of claim 16, wherein at least one of the CRMC firstand second ends is recessed inwardly into the active via hole from therespective insulator body fluid and device side end surfaces, andwherein the substantially pure platinum material extends to theinsulator body fluid and device side end surfaces.
 19. The filterfeedthrough of claim 16, wherein at least one of the CRMC first andsecond ends is recessed inwardly into the active via hole in theinsulator from the respective insulator body fluid and device side endsurfaces, and wherein a corresponding at least one of the substantiallypure platinum material first and second end is recessed inwardly intothe active via hole from the respective insulator body fluid and deviceside end surfaces, and wherein a metallic end cap extends from the atleast one recessed CRMC first and second end and the correspondinglyrecessed substantially pure platinum material first and second end tothe corresponding insulator body fluid and device side end surface. 20.The filter feedthrough of claim 19, wherein the metallic end capcomprises platinum.
 21. The filter feedthrough of claim 16, wherein thesubstantially pure platinum material is a platinum wire.
 22. The filterfeedthrough of claim 21, wherein the platinum wire is exposed at theinsulator device side end surface.
 23. The filter feedthrough of claim16, wherein a platinum wire extends through the substantially pureplatinum material to the insulator body fluid and device side endsurfaces, the platinum wire being spaced from the layer of CRMCcontacting the active via hole inner surface in the insulator.
 24. Afilter feedthrough that is attachable to an active implantable medicaldevice (AIMD), the filter feedthrough comprising: a) a feedthrough,comprising: i) an electrically conductive ferrule comprising: A) aferrule sidewall extending to a ferrule body fluid side end surface andto a ferrule device side end surface, the ferrule sidewall furthercomprising a ferrule outermost surface and a ferrule inner surfacedefining a ferrule opening extending to the ferrule body fluid anddevice side end surfaces with a peninsula extending from the ferrulesidewall inwardly into the ferrule opening, B) wherein the ferruleoutermost surface comprises opposed ferrule first and second outermostsurface portions meeting opposed ferrule third and fourth outermostsurface portions, and C) wherein when the ferrule is attached to anopening in a housing of an AIMD, the ferrule body fluid side end surfaceand the ferrule device side end surface reside outside the AIMD andinside the AIMD, respectively; ii) an insulator at least partiallyresiding in the ferrule opening where the insulator is hermeticallysealed to the ferrule, the insulator extending to an insulator bodyfluid side end surface and to an insulator device side end surfacelocated adjacent to the ferrule body fluid and device side end surfaces,respectively; iii) at least one active via hole extending through theinsulator to the insulator body fluid and device side end surfaces; andiv) an active conductive pathway at least partially residing in andhermetically sealed to the insulator in the at least one active viahole; and b) a feedthrough capacitor disposed on the device side of theferrule, the feedthrough capacitor comprising: i) a capacitor dielectrichaving a capacitor dielectric outer sidewall extending to a capacitordielectric first end surface and to a capacitor dielectric second endsurface, wherein the capacitor dielectric outer sidewall comprisesopposed capacitor dielectric first and second outer sidewall portionsmeeting opposed capacitor dielectric third and fourth outer sidewallportions; ii) at least one active electrode plate interleaved in acapacitive relationship with at least one ground electrode plate in thecapacitor dielectric; iii) at least one active passageway extendingthrough the capacitor dielectric to the capacitor dielectric first andsecond end surfaces; iv) a capacitor active metallization contacting thecapacitor dielectric in the at least one active passageway and being inan electrically conductive relation with the at least one activeelectrode plate; v) at least one ground passageway extending through thecapacitor dielectric to the capacitor dielectric first and second endsurfaces; vi) a capacitor ground metallization first portion contactingthe capacitor dielectric outer sidewall and being in an electricallyconductive relation with the at least one ground electrode plate; andvii) a capacitor ground metallization second portion residing in the atleast one ground passageway and being in an electrically conductiverelation with the at least one ground electrode plate; and c) a firstelectrical connection material electrically connecting the activeconductive pathway residing in the at least one active via hole in theinsulator to the active metallization electrically connected to the atleast one active electrode plate of the feedthrough capacitor; d) asecond electrical connection material first portion electricallyconnecting the capacitor ground metallization first portion electricallyconnected to the at least one ground electrode plate at the capacitordielectric outer sidewall to the ferrule, and a second electricalconnection material second portion electrically connecting the capacitorground metallization second portion electrically connected to the atleast one ground electrode plate in the at least one ground passagewayof the feedthrough capacitor to the ferrule peninsula; e) wherein animaginary projection of the ferrule outermost surface onto the capacitordielectric second end surface provides the ferrule first and secondoutermost surface portions intersecting the capacitor dielectric thirdand fourth outer sidewall portions to thereby define: A) a capacitordielectric first overhang portion comprising the capacitor dielectricfirst outer sidewall portion extending laterally outwardly beyond theferrule first outermost surface portion; B) a capacitor dielectricimaginary second overlay portion overlaying the ferrule device side endsurface and the insulator device side end surface, wherein at least oneof the capacitor dielectric third and fourth outer sidewall portions inthe capacitor dielectric imaginary second overlay portion is spacedinwardly from the ferrule outermost surface, and wherein the at leastone ground electrode plate at least partially resides in the capacitordielectric imaginary second overlay portion; and C) wherein thecapacitor ground metallization first portion contacting at least one ofthe capacitor dielectric third and fourth outer sidewall portions in thecapacitor dielectric imaginary second overlay portion is electricallyconnected to the ferrule device side end surface, spaced inwardly from acorresponding one of the at least one of the ferrule third and fourthoutermost surface portions, by the second electrical connection materialfirst portion.
 25. The filter feedthrough of claim 24, wherein theferrule device side end surface is provided with at least one recessedpocket residing adjacent to at least one of the ferrule third and fourthoutermost surface portions, the recessed pocket having a gold pocket-padnested therein and being electrically connected to the ferrule, andwherein the second electrical connection material first portionelectrically connects the capacitor ground metallization first portioncontacting at least one of the capacitor dielectric third and fourthouter sidewall portions and being in an electrically conductive relationwith the at least one ground electrode plate to the gold pocket-pad. 26.The filter feedthrough of claim 24, wherein a capacitor dielectric thirdoverhang portion comprises the capacitor dielectric second outersidewall portion extending laterally outwardly beyond the ferrule secondoutermost surface portion.
 27. The filter feedthrough of claim 24,wherein the ferrule first and second outermost surface portions arelonger than the ferrule third and fourth outermost surface portions, andwherein the capacitor dielectric first and second outer sidewallportions are longer than the capacitor dielectric third and fourth outersidewall portions.
 28. A filter feedthrough configured to be installedin an opening of a housing an active implantable medical device (AIMD),the filter feedthrough comprising: a) an electrically conductive ferruleseparating a body fluid side opposite a device side, the body fluid sideconfigured to reside outside the AIMD housing and the device sideconfigured to reside inside the AIMD housing, the ferrule including aferrule opening extending between and to the body fluid side and thedevice side; b) an insulator hermetically sealing the ferrule opening;c) at least one conductive pathway hermetically sealed to and disposedthrough the insulator between the body fluid side and the device side,the at least one conductive pathway being in non-electrically conductiverelation with the ferrule; and d) a feedthrough capacitor disposed onthe device side, e) wherein at least a first edge of the feedthroughcapacitor extends beyond a first outermost edge of the ferrule, and f)wherein at least a second edge of the feedthrough capacitor does notextend beyond a second outermost edge of the ferrule.
 29. A filterfeedthrough configured to be installed in an opening of a housing anactive implantable medical device (AIMD), the filter feedthroughcomprising: a) an electrically conductive ferrule separating a bodyfluid side opposite a device side, the body fluid side configured toreside outside the AIMD housing and the device side configured to resideinside the AIMD housing, the ferrule including a ferrule openingextending between and to the body fluid side and the device side; b) aninsulator hermetically sealing the ferrule opening by at least one of afirst gold braze, a ceramic seal, a glass seal or a glass-ceramic; c) atleast one conductive pathway hermetically sealed to and disposed throughthe insulator between the body fluid side and the device side, the atleast one conductive pathway being in non-electrically conductiverelation with the ferrule; and d) a feedthrough capacitor disposed onthe device side, the feedthrough capacitor comprising: i) at least oneactive electrode plate disposed parallel and spaced from at least oneground electrode plate, wherein the at least one active and groundelectrode plates are disposed within a capacitor dielectric; ii) acapacitor active metallization electrically connected to the at leastone active electrode plate and in non-electrically conductive relationwith the at least one ground electrode plate; and iii) a capacitorground metallization electrically connected to the at least one groundelectrode plate and in non-electrically conductive relation with the atleast one active electrode plate, e) wherein the capacitor activemetallization is electrically connected to the at least one conductivepathway, and f) wherein the capacitor ground metallization iselectrically connected to the ferrule, and g) wherein at least a firstedge of the feedthrough capacitor extends beyond a first outermost edgeof the ferrule, and h) wherein at least a second edge of the feedthroughcapacitor is either aligned with or is set back from a second outermostedge of the ferrule, and i) wherein the ferrule has a rectangular shape,the first outermost edge and the second outermost edge forming at leasta part of the rectangular shape, and j) wherein the first outermost edgeis perpendicularly disposed in relation to the second outermost edge.